Continuous Stiffness Measurement During Instrumented Indentation Testing

Hay, Jennifer L.; Agee, Phillip; Herbert, Erik G.

doi:10.1111/j.1747-1567.2010.00618.x

Cited by 208 publications

(117 citation statements)

References 9 publications

(18 reference statements)

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“…6(b), the elastic modulus E is determined between the indentation depth of 1000-1100 nm in Fig. 3(a) based on continuous stiffness measurement theory [10]. It is found that the average value of elastic modulus based on indentation responses are about 47.5 MPa which is greater than the elastic modulus as measured by constitutive experiments.…”

Section: Long Et Al Materials Science and Engineering A 696 (2017) mentioning

confidence: 85%

“…After being air dried, the obtained samples were stored at room temperature for more than 10 days to achieve a stable microstructure before indentation tests. Based on a continuous stiffness measurement technique [10], a Berkovich diamond pyramid indenter in the Nano Indenter G200 by Agilent Technologies was used for an identical pattern of five points on each sample. Experiments of nanoindentation for the control and annealed samples are performed by following the same procedure.…”

Section: Long Et Almentioning

confidence: 99%

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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Long

Wang

Feng

et al. 2017

Materials Science and Engineering: A

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In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210°C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1×10 −3 s −1 , 5×10 −4 s −1 and 1×10 −4 s −1 was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210°C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder.

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Section: Long Et Al Materials Science and Engineering A 696 (2017) mentioning

confidence: 85%

Section: Long Et Almentioning

confidence: 99%

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Long

Wang

Feng

et al. 2017

Materials Science and Engineering: A

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show abstract

“…This method shows good applicability during the high strain rate experiment, however, when it comes to low strain rates, the displacement of the indenter will be significantly affected by thermal drift. In 2010, the continuous stiffness measurement (CSM) that could decrease the influence of thermal drift was proposed by Hay et al [24]. In 2011, an indentation strain-rate-jump test method for measuring SRS proposed by Maier et al showed a significant mitigation of the thermal drift [25].…”

Section: Experimental Methodsmentioning

confidence: 99%

Thickness-Dependent Strain Rate Sensitivity of Nanolayers via the Nanoindentation Technique

et al. 2018

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Abstract:The strain rate sensitivity (SRS) and dislocation activation volume are two inter-related material properties for understanding thermally-activated plastic deformation, such as creep. For face-centered-cubic metals, SRS normally increases with decreasing grain size, whereas the opposite holds for body-center-cubic metals. However, these findings are applicable to metals with average grain sizes greater than tens of nanometers. Recent studies on mechanical behaviors presented distinct deformation mechanisms in multilayers with individual layer thickness of 20 nanometers or less. It is necessary to estimate the SRS and plastic deformation mechanisms in this regime. Here, we review a new nanoindentation test method that renders reliable hardness measurement insensitive to thermal drift, and its application on SRS of Cu/amorphous-CuNb nanolayers. The new technique is applied to Cu films and returns expected SRS values when compared to conventional tensile test results. The SRS of Cu/amorphous-CuNb nanolayers demonstrates two distinct deformation mechanisms depending on layer thickness: dislocation pileup-dominated and interface-mediated deformation mechanisms.

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“…Эта наиболее продвинутая ме-тодика обработки " сырых" данных принята стандартом РФ ГОСТ Р8.748-2011 и международным стандартом ISO-14577 [6] в качестве количественного метода харак-теризации физико-механических свойств твердых тел в нано-и микрошкалах. Однако еще более значительно расширить объем информации о деформационном от-клике материала в приповерхностном слое позволяет метод непрерывного измерения контактной жесткости (continuous stiffness measurement, CSM) [7][8][9][10]. Запатен-тованный еще в 1989 г.…”

Section: Introductionunclassified

“…При этом поведение дефектной структу-ры материалов в локальных сильнодеформированных объемах под инструментом/индентором в присутствии низкочастотных виброакустических колебаний изучено недостаточно. Правда, в последнее время появились экспериментальные свидетельства того, что физико-механические свойства ряда металлических материа-лов [4, 7,12,23,24,[26][27][28] при локальном нагружении мо-гут значительно измениться при наложении дополни-тельных гармонических осцилляций нагрузки.…”

Section: Introductionunclassified

Влияние Малоамплитудных Осцилляций Нагрузки На Наноконтактные Характеристики Материалов В Процессе Наноиндентирования

Головин¹,

Коренков²,

Razlivalova³

2017

Физика Твердого Тела

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Критически проанализирован метод непрерывного измерения контактной жесткости, позволяющий непрерывно определять физико-механические свойства исследуемых материалов в процессе внедрения индентора под действием медленно растущей нагрузки при наноиндентировании. Границы применимости этого подхода к характеризации определяются условиями тестирования, при которых дополнительное наложение малоамплитудных осцилляций не влияет на механизмы, кинетику и величину пластической деформации материала под индентором. На примере материалов с аморфной структурой, ГЦК- и ОЦК-решетками показано, что различные методы определения наноконтактных характеристик материалов обладают разной чувствительностью к малоамплитудным осцилляциям нагрузки. Определены значения амплитуд осцилляций и диапазон глубин отпечатка, для которых влиянием осцилляций можно пренебречь. Выявлены закономерности влияния осцилляций на поведение контактных (локальных) характеристик исследованных материалов в закритических режимах. Работа выполнена при поддержке Российского научного фонда (грант N 15-19-00181). DOI: 10.21883/FTT.2017.06.44483.398

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Continuous Stiffness Measurement During Instrumented Indentation Testing

Cited by 208 publications

References 9 publications

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Thickness-Dependent Strain Rate Sensitivity of Nanolayers via the Nanoindentation Technique

Влияние Малоамплитудных Осцилляций Нагрузки На Наноконтактные Характеристики Материалов В Процессе Наноиндентирования

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