Abstract:The previous etching, rinsing and drying processes of wafers for MEMS (microelectromechanical system) using SC-CO 2 (supercritical-CO 2 ) consists of two steps. Firstly, MEMS-wafers are etched by organic solvent in a separate etching equipment from the high pressure dryer and then moved to the high pressure dryer to rinse and dry them using SC-CO 2 . We found that the previous two step process could be applied to etch and dry wafers for MEMS but could not confirm the reproducibility through several experiments… Show more
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