Contamination of Electronic Assemblies

Bumiller, Elissa M.; Douthit, David A.; Pecht, Joan

doi:10.1201/9781420040067

Cited by 6 publications

(3 citation statements)

References 1 publication

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“…Unique to these solders is a rosin core, which is added to some solders to remove metal oxides 92 and improve adhesion (wetting) 106 at the soldersurface interface of the electronic circuit. As rosin is mildly acidic, 104,106 the presence of a rosin core might etch the surface of the Cu-tipped soldering gun and cause a transfer of Cu to the solder during the melting process. This leads to a spike in Cu concentration in only the melted portion of solder.…”

Section: Soldermentioning

confidence: 99%

Forensic analysis by solid sampling electrothermal vaporization coupled to inductively coupled plasma optical emission spectrometry

Moghadam

Beauchemin

2023

Chem. Commun.

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Section: Soldermentioning

confidence: 99%

Forensic analysis by solid sampling electrothermal vaporization coupled to inductively coupled plasma optical emission spectrometry

Moghadam

Beauchemin

2023

Chem. Commun.

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“…[6] As the PbO solubility is high in HCl, the interaction between the two elements improves consequently the formation of cerussite, a bulky and fragile corrosion product. That is why CO 2 is qualified as a contaminant in electronic [51] and attention is paid to the storage of the Pb-Sn alloy in sliding bearing. [46] In fact, during the corrosion process, the formed products consume and thin the Pb-Sn layer.…”

mentioning

confidence: 99%

What happens when a Pb–Sn coating deposited on low carbon steel is exposed in an HCl‐polluted wet environment? Development of a corrosion mechanism

Lequien

Moine

Lequien

et al. 2022

Materials & Corrosion

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This article synthesizes all the results obtained to establish a global corrosion mechanism when a Pb–Sn coating deposited on low carbon steel is corroded in an HCl‐polluted wet environment. The successive stages of the process are shown. In HCl‐polluted environment, coupled with water, acid chlorides provide an aggressive electrolyte particularly favorable to corrosion. In contact with this electrolyte, lead products are created as PbCO3 and PbCl2, showing the impact of the surrounding atmosphere. In parallel, the electrolyte concentrates in Sn2+ until saturation, and tin precipitates under different forms. Due to the lead consumption, the lead corrosion products layer breaks, and the coating thins, diffusion pathways are created and the steel oxidizes. Iron corrosion products are similar with or without a coating except for the presence of a tin‐rich filament. Lead is no longer present. The different stages of the mechanism are compared to corrosion phenomena observed during the use of Pb–Sn alloys to provide effective solutions to minimize or even avoid the phenomenon of corrosion.

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“…Based on the production and deposition process of these compounds, mobile ion contamination cannot be avoided. 9 Sodium is one of the main risks regarding ion migration, due to the high natural abundance and small ionic radius. Therefore, it is of utmost importance to develop strategies to hinder sodium ions from reaching sensitive areas of the device.…”

mentioning

confidence: 99%

Reduction of Sodium Migration in Polymers by Addition of 15-Crown-5 Ether as Getter Substance

Schwab¹,

Jung²,

Appenroth³

et al. 2017

ECS J. Solid State Sci. Technol.

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Already small amounts of ion contamination within sensitive areas of high voltage transistors can cause severe damage to semiconductor devices. Therefore, it is of utmost importance to hinder mobile ions from reaching critical regions (e.g., the gate oxide layer). To protect semiconductor devices from environmental influences and contamination, polymers are used for chip encapsulation. Reduction of ion migration within these polymers can increase the reliability of the semiconductor device. Crown ethers are well known to form stable complexes with alkali cations. Within this work the influence of 15-crown-5 ether on the sodium migration in poly-methyl methacrylate and polyimide will be evaluated by means of ion conductivity measurements.

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Contamination of Electronic Assemblies

Cited by 6 publications

References 1 publication

Forensic analysis by solid sampling electrothermal vaporization coupled to inductively coupled plasma optical emission spectrometry

Forensic analysis by solid sampling electrothermal vaporization coupled to inductively coupled plasma optical emission spectrometry

What happens when a Pb–Sn coating deposited on low carbon steel is exposed in an HCl‐polluted wet environment? Development of a corrosion mechanism

Reduction of Sodium Migration in Polymers by Addition of 15-Crown-5 Ether as Getter Substance

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