2011
DOI: 10.1063/1.3549183
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Contacting graphene

Abstract: We present a robust method for forming high quality ohmic contacts to graphene, which improves the contact resistance by nearly 6000 times compared to untreated metal/graphene interfaces. The optimal specific contact resistance for treated Ti/Au contacts is found to average <10−7 Ω cm2. Additionally, we examine Al/Au, Ti/Au, Ni/Au, Cu/Au, Pt/Au, and Pd/Au contact metallizations and find that most metallizations result in similar specific contact resistances in this work regardless of the work function d… Show more

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Cited by 325 publications
(314 citation statements)
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“…E-mail: Thomas.Seyller@physik.tu-chemnitz.de (Thomas Seyller) dependent [4] and it has been observed that this is a direct consequence of the presence of the buffer layer [10]. In recent years, various elements such as gold [11], lithium [12], silicon [13], fluorine [14], germanium [15], oxygen [16][17][18][19] and hydrogen [10,[20][21][22][23] have been intercalated between the buffer layer and SiC(0001) in order to modify the interface.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…E-mail: Thomas.Seyller@physik.tu-chemnitz.de (Thomas Seyller) dependent [4] and it has been observed that this is a direct consequence of the presence of the buffer layer [10]. In recent years, various elements such as gold [11], lithium [12], silicon [13], fluorine [14], germanium [15], oxygen [16][17][18][19] and hydrogen [10,[20][21][22][23] have been intercalated between the buffer layer and SiC(0001) in order to modify the interface.…”
Section: Introductionmentioning
confidence: 99%
“…Hydrogen has been shown to work well, leading to so-called quasi-free-standing monolayer graphene (QFMLG) with improved electrical properties [10,[22][23]] when compared to normal MLG which resides on the buffer layer. Hydrogen is therefore a prime candidate for the future integration of quasi-free-standing graphene into devices.…”
Section: Introductionmentioning
confidence: 99%
“…This resistance is a limiting factor for the performance of electronic devices, and an increasing amount of research has concentrated on this issue. [2][3][4][5][6][7][8] The relative contribution of contact resistance to the total device resistance becomes larger in devices with shorter inter-electrode spacings, i.e., in shorter channel devices. Therefore, contact resistance becomes a predominant factor to consider when attempting to achieve miniaturization and integration of graphene devices.…”
Section: Introductionmentioning
confidence: 99%
“…3,4 R C for contacts formed to epitaxial graphene on SiC have been reported to be less than 100 Ω μm 5 and with specific contact resistivity (ρ c ) of order 10 -7 Ω cm 2 . 5,6 Reported values of R c for chemical vapor deposited (CVD) graphene typically range from 500 Ω μm to 1000 Ω μm. 7,8 Despite the technological attractiveness of CVD grown graphene, these contact resistances remain too large for most applications and are far from that reported for contacts to epitaxial graphene on SiC.…”
mentioning
confidence: 99%