Contact Problem Of Conducting And Heated Punch On A Multifield Foundation

Abstract

The solution for a multifield material subjected to temperature loading in a circular region is presented in an explicit analytical form. The study concerns the steady -state thermal loading infinite region (heated embedded inclusion), half -space region and two -constituent magneto -electro -thermo -elastic material region. The new mono -harmonic potential functions, obtained by the author, are used in the analysis of punch problem. The more interested case in which the contact region is annular is analyzed. By using the methods of triple integral equations and series solution technique the solution for an indentured multifield substrate over an annular contact region is given. The sensitivity analysis of obtained indentation parameters shows some interesting points. In particular, it shows that the increasing of the applied electric and magnetic potentials reduces the indentation depth in multifield materials.