Contact engineering for nano‐scale CMOS

Abstract

High performance computation with longer battery lifetime is an essential component in our today's digital electronics oriented life. To achieve these goals, field effect transistors based complementary metal oxide semiconductor play the key role. One of the critical requirements of transistor structure and fabrication is efficient contact engineering. To catch up with high performance information processing, transistors are going through continuous scaling process. However, it also imposes new challenges to integrate good contact materials in a small area. This can be counterproductive as smaller area results in higher contact resistance thus reduced performance for the transistor itself. At the same time, discovery of new one or two‐dimensional materials like nanowire, nanotube, or atomic crystal structure materials, introduces new set of challenges and opportunities. In this paper, we are reviewing them in a synchronized fashion: fundamentals of contact engineering, evolution into non‐planar field effect transistors, opportunities and challenges with one and two‐dimensional materials and a new opportunity of contact engineering from device architecture perspective.

Role of metal/silicon semiconductor contact engineering for enhanced output current in micro‐sized microbial fuel cells

“…Single cells were then cleaved from the substrate and their backsides were sputtered according to the specifications of each metal for the contact study. The as‐deposited metals formed a Schottky contact whereas the post deposition annealed metals formed an Ohmic contact .…”

Mechanically flexible optically transparent silicon fabric with high thermal budget devices from bulk silicon (100)

“… Innovative architecture such as FinFET or one-dimensional nanowire devices need to be used. In the recent past we have shown nanotube made up of conventional channel materials can provide both the high performance and ultra-low power operation with area efficiency [17][18][19][20][21] . In most of the occasions such non-planar architecture requires complicated fabrication process and integration.…”