Construction of stable hydrogen bonds at high temperature for preparation of polyimide films with ultralow coefficient of thermal expansion and high Tg

Tian, Yiyao; Luo, Longbo; Yang, Qiqi; Zhang, Lingjie; Wang, Ming; Wu, Difeng; Wang, Xu; Li, Xiangyang

doi:10.1016/j.polymer.2019.122100

Cited by 47 publications

(31 citation statements)

References 70 publications

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“…Coefficient of thermal expansion (CTE) was examined using a TA Instrument TMA Q400 in the range of 50-300 C at a heating rate of 5 C min À1 with a xed load of 0.5 g mm À1 (lm thickness) in nitrogen. The tensile properties of polymer lms were evaluated on a Shimadzu AG-I universal testing apparatus at speed of 5.0 mm min À1 , and tensile strength (s), tensile modulus (E) and elongation at break (3) were demonstrated as the average of ve strips. The net charge on nitrogen atoms and energy minimized structures on the molecules was achieved through the B3LYP (Becke, threeparameter, Lee-Yang-Parr) exchange-correlation functional for the 6-311G(d,p) basis set basis set in Gaussian 09W.…”

Section: Characterizationmentioning

confidence: 99%

“…Poly(benzimidazole imide) (PBIIs), combining the superiority of polyimides (PIs) and polybenzimidazoles (PBIs), are a class of promising polymers in engineering and science. [1][2][3] Among their outstanding properties, the high thermal properties with T g values normally greater than 400 C have gained attention. 4,5 Previous research has proven that the excellent superheatresistant ability of PBIIs can be ascribed to the intermolecular hydrogen bonds formed between the proton donors (N-H group) and proton acceptors (-N] or C]O).…”

Section: Introductionmentioning

confidence: 99%

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Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency

et al. 2021

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Section: Characterizationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency

et al. 2021

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“…针对化学交联法调控聚酰亚胺薄膜面内热膨胀的研究报道已有很多，例如通过引入三官能团单体、炔基、苯并环丁烯或金属离子配位基团等方式，可获得具有不同交联程度的聚酰亚胺薄膜，有效降低薄膜的面内热膨胀系数 [52][53][54][55][56][57] . 从分子结构设计角度而言， Liou 等 [25] 将马来酸酐或苯乙炔基封端的可交联低聚物，分别与 PMDA/ODA、BPDA/PDA 的商品化前驱体溶液共混，制备了厚度为 10 μm 的交联型聚酰亚胺薄膜.…”

Section: 化学交联结构unclassified

Research progress in thermal expansion behavior of polyimide films

Wang¹,

Zhai²,

Gao³

et al. 2022

Sci. Sin.-Chim

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As one of the most important flexible substrates and interlayer dielectric materials, the thermal expansion performance of polyimide films has always attracted great interest. Especially with the development of advanced electronic and microelectronic devices, the linear and volumetric thermal expansion of polyimide films are facing more and more stringent requirements. In order to explore new generation polyimide films with low thermal expansion, it is necessary to clarify the thermal expansion behaviors and influence mechanism. For polymer films, the thermal expansion actually includes in-plane and out-of-plane linear as well as volumetric thermal expansion. Most researches on thermal expansion of polyimide films are focused on the in-plane thermal expansion, but there are few studies on the out-of-plane and volume thermal expansion of films. There is no systematic understanding of comprehensive and anisotropic of thermal expansion of films. The research on linear and volume thermal expansion behavior of polyimide films were firstly summarized in this paper. The testing methods were introduced in detail, including thermomechanical analysis (TMA), variable temperature wide-angle X-ray diffraction (VT-WAXD), capacitance technique, optical interferometry, etc. The influencing factors of thermal expansion behavior of polyimide films were discussed, such as molecular backbone structures, local molecular motions, chemical crosslinking, aggregation structures and film preparation process. The relationship between structures and processes on in-plane, out-of-plane linear and volumetric thermal expansion behavior of polyimide films was clarified. The problems and challenges in the future research on thermal expansion were prospected. This review can provide a necessary guidance for the development of high-performance polyimide films with low thermal expansion during wide temperature range.

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“…For example, amide structure could be introduced into the molecular skeleton of CPI film to decrease the CTE value of the film. 3,9,19…”

Section: Introductionmentioning

confidence: 99%

Transparent polyimide films with ultra-low coefficient of thermal expansion

Zhang

Yang

Piao

et al. 2022

High Performance Polymers

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According to the application requirements of colorless transparent polyimide (CPI) film for low coefficient of thermal expansion (CTE) in the field of OLED display, the new aromatic dianhydride monomers with amide bond structure were synthesized, namely s-ABDA, i-ABDA, EADA. Furthermore, a series of CPI films were prepared by two-step method from the reaction of as-synthesized dianhydrides with 2.2′-bis (trifluoromethyl) −4.4′-diaminobiphenyl (TFMB) or trans-1.4′-cyclohexanediamine ( t-CHDA). Based on the analysis of performance results, the incorporation of amide group and biphenyl, benzene or ether bond into dianhydride monomer helped this new type of transparent polyimide film with excellent optical properties (T550 nm> 88%), great heat stability (CTE < 4.4 ppm/K; Tg > 314°C; Td5% > 478°C) and good mechanical strength (σ > 208 MPa). The film s-ABDA/TFMB showed ultra-low CTE value at 4.4 ppm/K, aligning with the maximum birefringence, indicating that the role of hydrogen bonding was of great benefit to the regulation of thermal expansion.

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Construction of stable hydrogen bonds at high temperature for preparation of polyimide films with ultralow coefficient of thermal expansion and high Tg

Cited by 47 publications

References 70 publications

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency

Research progress in thermal expansion behavior of polyimide films

Transparent polyimide films with ultra-low coefficient of thermal expansion

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Construction of stable hydrogen bonds at high temperature for preparation of polyimide films with ultralow coefficient of thermal expansion and high Tg

Cited by 47 publications

References 70 publications

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H2O-absorbtion and transparency

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H2O-absorbtion and transparency

Research progress in thermal expansion behavior of polyimide films

Transparent polyimide films with ultra-low coefficient of thermal expansion

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Product

Resources

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Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency

Incorporation ofN-phenyl in poly(benzimidazole imide)s and improvement in H₂O-absorbtion and transparency