2021
DOI: 10.1016/j.jneumeth.2020.109011
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Construction of simple, customised, brain-spanning, multi-channel, linear microelectrode arrays

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Cited by 5 publications
(4 citation statements)
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“…Besides handling and placement, the soldering of the microwires was another labor-intensive and time-consuming step during the MEA fabrication. Worse yet, some microwire materials, such as stainless steel and tungsten, had nonoptimal solderability and would usually require extra steps of surface cleaning, pre-plating, pre-tinning, or specialized soldering [ 24 , 33 , 34 ]. To overcome these challenges, the conductive silver epoxy (EPO-TEK H20E by Epoxy Technology Inc., Billerica, MA, USA) was applied using a sewing needle to create the electrical connections between the microwires and the PCB gold pads ( Figure 5 e).…”
Section: Methodsmentioning
confidence: 99%
“…Besides handling and placement, the soldering of the microwires was another labor-intensive and time-consuming step during the MEA fabrication. Worse yet, some microwire materials, such as stainless steel and tungsten, had nonoptimal solderability and would usually require extra steps of surface cleaning, pre-plating, pre-tinning, or specialized soldering [ 24 , 33 , 34 ]. To overcome these challenges, the conductive silver epoxy (EPO-TEK H20E by Epoxy Technology Inc., Billerica, MA, USA) was applied using a sewing needle to create the electrical connections between the microwires and the PCB gold pads ( Figure 5 e).…”
Section: Methodsmentioning
confidence: 99%
“…Besides handling and placement, the soldering of the microwires was another labor-intensive and time-consuming step during MEA fabrication. Worse yet, some microwire materials like stainless steel and tungsten had nonoptimal solderability and would usually require extra steps of surface cleaning, pre-plating, pre-tinning, or specialized solder [18, 27, 28]. To overcome these challenges, conductive silver epoxy (EPO-TEK H20E by Epoxy Technology Inc., Billerica, MA) was applied using a sewing needle to create electrical connections between microwires and the PCB gold pads (Fig.…”
Section: Methodsmentioning
confidence: 99%
“…For PrL, 11 tips were spaced 500 μm apart to cover most of the medial wall of the prefrontal cortex. For further details see Banstola et al (2021).…”
Section: Local Field Potential Recording and Stimulation Electrodesmentioning
confidence: 99%