Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

Abstract

There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielectric permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielectric permittivity (2.47) and dielectric loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the molecular polarizability but also increased the free fractional volume. In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI molecular chains, resulting in the inhibition of the molecular mobility. The incorporation of TAPB also enhanced the thermal stability and ultraviolet light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielectric permittivity for the electronic industry.

Increasing Twist Rigidity to Prepare Polyimides with Low Dielectric Constants and Dissipation Factors over a Wide Temperature Range

“…The introduction of rigid side groups allowed for improved solubility processing without a significant loss of heat resistance and mechanical properties, and the prepared PIs showed superior overall performance. The prepared PI is compared to the reported results in Figure d, which demonstrates that the addition of rigid side groups maintains the excellent heat resistance, mechanical properties, and significantly increases the solvency processability, putting the overall film properties at a well-balanced level after ideal dielectric properties are ensured. Moreover, the film also exhibits stable D f over a broad temperature range, which has been rarely exhibited in the available research.…”

Effect of Fluorinated Substituents on Solubility and Dielectric Properties of the Liquid Crystalline Poly(ester imides)

“…High-performance polymers possessing low dielectric constant ( D k ) and low dielectric loss ( D f ) are crucial for 5G communication technology. − The dielectric properties of the fluorinated PEIs films at 10 GHz are evaluated by the Network analyzer equipped with resonant cavity. The values are listed in Table .…”

Layer-by-Layer Electrode Fabrication for Improved Performance of Porous Polyimide-Based Supercapacitors

“…A temperature of 546 °C was observed at 5% weight loss for Per-TAPB-PPI, which is on par with the current state-of-the-art porous polyimides [ 24 , 34 ], and it emphasises the advantage of using imide-linkages in porous polymers. Finally, while the specific use of the monomer TAPB was mainly to promote porous framework formation, it may have added benefits to the final material in terms of optoelectronic and mechanical properties [ 35 ].…”