“…The widely used high in-plane thermal conductivity TIMs could rapidly decrease the interface thermal resistance and dissipate the heat from the chip along the in-plane direction without affecting the operation of nearby components. Polymer-based TIMs had drawn intensive attention due to the excellent insulation, processing, and flexibility. − However, the low thermal conductivity of polymer (0.1–0.5 W·m –1 ·K –1 ) caused by the chain entanglements and disorder limited their practical applications. , In order to improve the thermal conductivity of polymers, the incorporation of high thermal conductive filler (i.e., graphene, diamond, h-BN, Al 2 O 3 , SiC, AlN, Al, and Ag) was an effective method. − Among these thermal conductive fillers, graphene, carbon nanotube, and metal particles had good conductive performance, which would decrease the electrical insulation performance of polymer composites with their addition. Nevertheless, in most cases, the used TIMs should have both excellent thermal conductivity and electrical resistivity.…”