2022
DOI: 10.1021/acsapm.1c01705
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Constructing a High-Density Thermally Conductive Network through Electrospinning–Hot-Pressing of BN@PDA/GO/PVDF Composites

Abstract: Polymer matrix composites with high thermal conductivity and elastic mechanical properties are promising materials for diverse practical applications. Herein, BN@PDA/ GO/PVDF (PG) composite materials with a highly dense thermally conductive network were prepared by combining electrospinning and hot-pressing methods. Dopamine was used to modify hexagonal boron nitride (h-BN). The π−π interaction between the crystal plane structure of h-BN and the benzene ring in the polydopamine (PDA) structure can increase the… Show more

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Cited by 13 publications
(10 citation statements)
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“…The higher melt peak displacement is attributed to the uniform distribution and nucleation of nanoparticles. 34 The GO layer has a good affinity with the polar P(VDF-HFP) chain, resulting in substantial nucleation in the polymer matrix, thus promoting the increase of β crystal content. Figure 4 b,c shows the thermogravimetric analysis (TGA) and differential thermal analysis (DTA) curves of the composite.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The higher melt peak displacement is attributed to the uniform distribution and nucleation of nanoparticles. 34 The GO layer has a good affinity with the polar P(VDF-HFP) chain, resulting in substantial nucleation in the polymer matrix, thus promoting the increase of β crystal content. Figure 4 b,c shows the thermogravimetric analysis (TGA) and differential thermal analysis (DTA) curves of the composite.…”
Section: Resultsmentioning
confidence: 99%
“…The melting peak displacement of PFPCGO samples doped with double fillers is the largest, and the exothermic peak is 153.5 °C. The higher melt peak displacement is attributed to the uniform distribution and nucleation of nanoparticles . The GO layer has a good affinity with the polar P­(VDF-HFP) chain, resulting in substantial nucleation in the polymer matrix, thus promoting the increase of β crystal content.…”
Section: Resultsmentioning
confidence: 99%
“…The widely used high in-plane thermal conductivity TIMs could rapidly decrease the interface thermal resistance and dissipate the heat from the chip along the in-plane direction without affecting the operation of nearby components. Polymer-based TIMs had drawn intensive attention due to the excellent insulation, processing, and flexibility. However, the low thermal conductivity of polymer (0.1–0.5 W·m –1 ·K –1 ) caused by the chain entanglements and disorder limited their practical applications. , In order to improve the thermal conductivity of polymers, the incorporation of high thermal conductive filler (i.e., graphene, diamond, h-BN, Al 2 O 3 , SiC, AlN, Al, and Ag) was an effective method. Among these thermal conductive fillers, graphene, carbon nanotube, and metal particles had good conductive performance, which would decrease the electrical insulation performance of polymer composites with their addition. Nevertheless, in most cases, the used TIMs should have both excellent thermal conductivity and electrical resistivity.…”
Section: Introductionmentioning
confidence: 99%
“…4−6 However, the low thermal conductivity of polymer (0.1−0.5 W•m −1 •K −1 ) caused by the chain entanglements and disorder limited their practical applications. 7,8 In order to improve the thermal conductivity of polymers, the incorporation of high thermal conductive filler (i.e., graphene, diamond, h-BN, Al 2 O 3 , SiC, AlN, Al, and Ag) was an effective method. 9−19 Among these thermal conductive fillers, graphene, carbon nanotube, and metal particles had good conductive performance, which would decrease the electrical insulation performance of polymer composites with their addition.…”
Section: Introductionmentioning
confidence: 99%
“…There are various approaches to preparing micro/nanofibers, such as stretching method, microphase separation, solution method, spin-coating method, and electrospinning process. [58][59][60][61] In the case of ion-gel fibrous membrane, the most commonly used methods are spin-coating and electrospinning. Although the spin-coating method is simple to operate, the formed film is poorly uniform and generally has some morphological defects.…”
Section: Introductionmentioning
confidence: 99%