2004
DOI: 10.4164/sptj.41.350
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Constrained Sintering of the Sandwich Substrate with Inner-constraining Fine Particles Layer

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Cited by 10 publications
(3 citation statements)
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“…Namely, during the sintering process, the molten glass penetrates into the pores among the particles in the ceramic particle layer to form a low-porosity compound solid member consisting of glass and ceramic. The authors have proven that this method, combined with inhibition of LTCC substrates' sintering shrinkage, can improve the bending strength of LTCC substrates 9,10) .…”
Section: Introductionmentioning
confidence: 99%
“…Namely, during the sintering process, the molten glass penetrates into the pores among the particles in the ceramic particle layer to form a low-porosity compound solid member consisting of glass and ceramic. The authors have proven that this method, combined with inhibition of LTCC substrates' sintering shrinkage, can improve the bending strength of LTCC substrates 9,10) .…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5] LTCCs are used as a small passive component that is co-firable with a wiring conductor with a high conductivity, such as Cu, Ag, or Au, by lowering the sintering temperature of the ceramic used as the insulating layer. [6][7][8][9][10][11][12][13][14][15][16] LTCCs have a very small dielectric loss, which affects the high-frequency properties, when compared with organic resin generally used as insulating materials in electronic circuits. 17) Therefore, LTCCs are suitable materials for constructing filters.…”
Section: Introductionmentioning
confidence: 99%
“…There are three main processes involved in nonshrinkage (in the x – y direction) sintering technology for LTCC, 6–10 that is, self‐constrained sintering, pressureless constrained sintering, and pressure‐assisted constrained sintering. Although the conventional free sintering process is cost effective, the variation in the dimensions of the fired circuit design and its dimensional tolerances are large.…”
Section: Introductionmentioning
confidence: 99%