Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys

Chan, D.; Nie, Xu; Bhate, D.; Subbarayan, Ganesh; Chen, W. W.; Dutta, I.

doi:10.1109/tcpmt.2012.2211022

Cited by 8 publications

(3 citation statements)

References 20 publications

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“…For a given solder alloy, the microstructure is affected by the soldering process and aging conditions and continues to evolve under field or test conditions. [78][79][80][81] How to capture these microstructural effects in predictive models represents a formidable task that has just begun to be addressed. 82…”

Section: Future Model Development Guidelines and Challengesmentioning

confidence: 99%

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Clech¹,

Coyle

Arfaei

2018

JOM

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Acceleration factors and predictive life models are of use to build-in board assembly reliability and estimate solder joint life at the design stage. They allow designers to answer management and end-users' reliability questions. This paper reviews the grand families of solder joint reliability models that can help answer these types of questions. Different categories of models were reviewed, examples were provided and model limitations were discussed. Emphasis is on engineering models for Sn-Pb and Pb-free assemblies. Differences in the microstructure and failure mechanisms of near-eutectic Sn-Ag-Cu solders versus Sn-Pb are also reviewed, as they present new challenges to the development of thermo-mechanical models for surface mount assembly reliability assurance.

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Section: Future Model Development Guidelines and Challengesmentioning

confidence: 99%

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Clech¹,

Coyle

Arfaei

2018

JOM

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“…Lots of scholars implemented the Anand model to simulate the stress-strain relationship of a variety of solders successfully. [4][5][6][7][8][9][10][11][12][13] However, Chen et al 3 found that the Anand model cannot accurately predict the response of material which has the specification of strong strain-hardening effect at low temperature. Thus, they proposed a modified Anand model by correlating h 0 with temperature and strain rate…”

Section: Models Without the Definition Of Yield Surfacementioning

confidence: 99%

A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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“…Arising from concerns over the toxicity of Pb, there is a global trend towards Pb-free solder to yield environmentallyfriendlier 'green' products. Experimental studies on various solder alloys have shown apparent strain rate sensitivity in their mechanical properties [3][4][5][6]. However, the stress-strain curves obtained from bulk solder are not fully sufficient to describe the mechanical response of a solder joint.…”

Section: Introductionmentioning

confidence: 99%

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

et al. 2015

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A novel method for dynamic testing of small specimens, based on impact loading, is proposed. This is motivated by the desire to elicit the dynamic mechanical response of single solder joints measuring 0.5 mm smaller in size. Impact loading is generated through impact of a tubular striker against a loading plate which is initially in contact with the specimen. The mechanical response of the specimen is derived from noting the stress waves generated in slender bars attached to the loading plate and specimen. Through this approach, dynamic tension or compression can be conveniently applied using the same test apparatus, and exact alignment of the slender bars attached is not critical. In addition, wave dispersion or attenuation in the bars (e.g., when polymer bars are used) has much less influence on the accuracy of results obtained. The equations governing this novel approach are derived and validated by finite element modeling. A prototype of a miniature impact tester was consequently fabricated, and tests on small aluminum specimens showed results comparable to that employing traditional split Hopkinson bar systems. The test arrangement was utilized for dynamic testing of lead-free single solder joint specimens, and initial results obtained are presented.

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Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys

Cited by 8 publications

References 20 publications

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

Pb-Free Solder Joint Thermo-Mechanical Modeling: State of the Art and Challenges

A critical review of constitutive models for solders in electronic packaging

A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments

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