Abstract:In order to characterize the material behavior of copper films deposited on silicon substrate, wafer curvature experiments were performed. The samples were exposed to repeated cycles in the range between -50°C to 400°C. The diagrams of film stress versus temperature show linear film behavior followed by plastic flow. Tn fact, a pronounced Bauschinger effect was observed which is attributed to back-stress arising from the dislocation structure in copper films. For better understanding of the underlying mechanis… Show more
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