Constitutive Modeling of Lead-Free Solders

Pei, Min; Qu, Jianmin

doi:10.1115/ipack2005-73411

Cited by 11 publications

(15 citation statements)

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“…11 Peak stress-strain rate relationships derived from literature for SnAgCu 405/387 specimen. The solid markers represent data from bulk testing, the rest are from interconnection level testing obtained from this work with low aspect ratio solder joints is in very good agreement with that published by Pei and Qu [13] for bulk Sn4.0Ag0.5Cu solder alloy.…”

Section: Discussionsupporting

confidence: 70%

“…Test data from several different sources [10,13,14] relating to room temperature monotonic testing of Sn4.0Ag0.5Cu interconnections (and in a few cases Sn3.Ag0.7Cu -processing tolerances effectively reduce both alloys to the same composition for purposes of comparison) has been compiled in Figure 11. The peak stress (as opposed to yield stress) is plotted versus strain rate due to the lack of clarity in several of the publications reviewed on the specific measurement of yield stress.…”

Section: Discussionmentioning

confidence: 99%

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Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys

Bhate

Chan

Subbarayan

et al.

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

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Commonly, constitutive models of solder alloys are derived from mechanical tests performed on either bulk solder specimens or on specially assembled BGA test coupons where the stresses are borne by solder ball interconnects. It has been widely recognized that models derived from bulk sample test data may not be reliable when predicting deformation behavior at the solder interconnect level due to the differences in the inherent microstructures at these different scales. This is particularly critical for lead-free SnAgCu solder alloys owing to their complex microstructures. There are two primary challenges associated with developing models from solder interconnect level test data: the experimental complexity associated with accurately resolving and controlling displacement at the scale of the interconnection, and the nonuniformity of stresses inherent in the solder interconnection geometry. In testing at interconnection level, published studies have used testing techniques that don't control deformation at the interconnect and have made uniformity of stress (and strain) approximations that are mostly invalid. Developing constitutive models from such data can produce erroneous results. In this study, we first demonstrate tests that control deformation at the interconnection level. We then show how heterogeneous stress distribution in solder interconnects can significantly affect the constitutive modeling of solder alloys and describe the conditions under which approximations may be made in the determination of accurate constitutive models. We validate our approach through experimental testing on Sn3.8Wwt%Ag0.7Wt%Cu solder joints and finite element analysis.

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Section: Discussionsupporting

confidence: 70%

Section: Discussionmentioning

confidence: 99%

Solder interconnection specimen design and test control procedure for vaild constitutive modeling of solder alloys

Bhate

Chan

Subbarayan

et al.

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

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show abstract

“…For SnAgCu solders, creep characterization and constitutive model development had been conducted by many researchers, e.g., [12][13][14]. Most of these works focused on the creep responses under tensile or shear loadings, and are useful for considering solder joint response under board level temperature cycling or mechanical bending due to the consistency in the loading directions.…”

Section: Sn38ag07cu Constitutive Behaviormentioning

confidence: 99%

Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load

Chiu¹,

Lin²,

Yang³

et al. 2010

Microelectronics Reliability

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“…The nine temperature dependent parameters (9) for the ANAND model are described in Table 2 [20]. The material parameters can be the result of experimental data (e.g.…”

Section: Stress Distributionmentioning

confidence: 99%

“…The deformation of the packages due to the stress distribution will be investigated with two comparison stresses: the Von Mises Stress Table 2 Temperature dependent ANAND parameters of SAC305 [20]. (VMS) and the hydrostatical stress (HS).…”

Section: Stress Distributionmentioning

confidence: 99%