Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy

Mysore, Kaushik; Subbarayan, Ganesh; Gupta, Vikas; Ron, Zhang

doi:10.1109/tepm.2009.2024119

Cited by 105 publications

(27 citation statements)

References 32 publications

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“…In previous work by (among others) Darveaux and Bannerji 1 (on Sn-Pb), Bhate et al 2 (on Sn-3.8Ag-0.7Cu and Sn-1.0Ag-0.5Cu), and Mysore et al 3 (on Sn-3.0Ag-0.5Cu), constitutive model fits from such experimental data were presented. Towashirporn et al 4 utilized the constitutive model together with a novel failure theory to develop experimentally validated fatigue crack propagation simulations in these ductile alloys undergoing significant plastic deformation.…”

Section: Introductionmentioning

confidence: 99%

Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

Tucker

Chan

Subbarayan

et al. 2011

Journal of Elec Materi

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During the transition from Pb-containing solders to Pb-free solders, joints composed of a mixture of Sn-Pb and Sn-Ag-Cu often result from either mixed assemblies or rework. Comprehensive characterization of the mechanical behavior of these mixed solder alloys resulting in a deformationally complete constitutive description is necessary to predict failure of mixed alloy solder joints. Three alloys with 1 wt.%, 5 wt.%, and 20 wt.% Pb were selected so as to represent reasonable ranges of Pb contamination expected from different 63Sn-37Pb components mixed with Sn-3.0Ag-0.5Cu. Creep and displacementcontrolled tests were performed on specially designed assemblies at temperatures of 25°C, 75°C, and 125°C using a double lap shear test setup that ensures a nearly homogeneous state of plastic strain at the joint interface. The observed changes in creep and tensile behavior with Pb additions were related to phase equilibria and microstructure differences observed through differential scanning calorimetric and scanning electron microscopic cross-sectional analysis. As Pb content increased, the steady-state creep strain rates increased, and primary creep decreased. Even 1 wt.% Pb addition was sufficient to induce substantially large creep strains relative to the Sn-3.0Ag-0.5Cu alloy. We describe rate-dependent constitutive models for Pb-contaminated Sn-Ag-Cu solder alloys, ranging from the traditional time-hardening creep model to the viscoplastic Anand model. We illustrate the utility of these constitutive models by examining the inelastic response of a chip-scale package (CSP) under thermomechanical loading through finite-element analysis. The models predict that, as Pb content increases, total inelastic dissipation decreases.

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Section: Introductionmentioning

confidence: 99%

Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

Tucker

Chan

Subbarayan

et al. 2011

Journal of Elec Materi

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“…Lots of scholars implemented the Anand model to simulate the stress-strain relationship of a variety of solders successfully. [4][5][6][7][8][9][10][11][12][13] However, Chen et al 3 found that the Anand model cannot accurately predict the response of material which has the specification of strong strain-hardening effect at low temperature. Thus, they proposed a modified Anand model by correlating h 0 with temperature and strain rate…”

Section: Models Without the Definition Of Yield Surfacementioning

confidence: 99%

A critical review of constitutive models for solders in electronic packaging

Chen

Zhao

2017

Advances in Mechanical Engineering

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Owing to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging. Because the failure of the whole electronic packaging is often induced by the failure of solders, modeling and simulation of solder joint performance are quite important in ensuring the quality and reliability of electronic products. In fact, the accuracy of reliability design of electronic packaging is dependent on accelerated reliability tests, material constitutive models, finite element modeling, and fatigue-life prediction models. Here, the material constitutive model plays the most important role in the development of electronic reliability design because the stress, strain, and strain energy density adopted in finite element modeling and fatigue-life prediction are all computed and derived from the constitutive model. In this work, the constitutive models developed for simulating the complex stress and strain response of solders are critically reviewed. To make the description concise and comprehensive, the constitutive models were categorized into two types: the constitutive models with and without the definition of yield surface. The prediction capabilities, application scope, merits and shortcomings, and objective suggestions for the further development of constitutive models for solders in electronic packaging are proposed.

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“…The isothermal cyclic loading tests on Sn3.8Ag0.7Cu samples at different temperature were conducted by a custom-built microscale mechanical tester as shown in photograph in Figure 3.4 and schematic in train and ensures the accuracy of constant strain rate control [18,32]. The whole test system is controlled via a software interface built in Labview2009, which could control the linear stage to perform creep test, monotonic movement, and cyclic loading.…”

Section: Equipment Experimental Setup and Test Samplesmentioning

confidence: 99%