“…A good knowledge of the relationship between the process parameters and the resultant structure of the film is required to obtain the desired properties of the deposit [57,58,59,60,61,62,63,64,65,66,67,68,69,70]. The monitoring of many rf-sputtering parameters, i.e., sputter power, working atmosphere, working pressure, target-substrate distance ( d st ), and deposition temperature ( T s ), allows us to control the texture, orientation and crystallinity of LCO thin films.…”