Considering Van Der Waals Forces in Micromanipulation Design

Sun, Lining; Wang, Lefeng; Rong, Weibin; Chen, Liguo

doi:10.1109/icma.2007.4303950

Cited by 3 publications

(1 citation statement)

References 14 publications

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“…The above studies provide useful guidance for the control of pulling velocity and preload in actual transfer printing operations for films. However, for spherical transferred elements, which are often involved in micro-assembly [14], the interfacial mechanical behaviors during transfer printing are lacking in terms of systematic investigation. Furthermore, the effects of work of adhesion on the transfer printing mechanics are also unclear.…”

Section: Introductionmentioning

confidence: 99%

Investigations on the Adhesive Contact Behaviors between a Viscoelastic Stamp and a Transferred Element in Microtransfer Printing

Jiang

et al. 2021

Coatings

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Microtransfer printing is a sophisticated technique for the heterogeneous integration of separately fabricated micro/nano-elements into functional systems by virtue of an elastomeric stamp. One important factor influencing the capability of this technique depends on the adhesion between the viscoelastic stamp and the transferred element. To provide theoretical guidance for the control of adhesion in the transfer printing process, a finite element model for the viscoelastic adhesive contact between a polydimethylsiloxane (PDMS) stamp and a spherical transferred element was established, in which the adhesive interaction was modeled by the Lennard-Jones surface force law. Effects of the unloading velocity, preload, and thermodynamic work of adhesion on the adhesion strength, characterized by the pull-off force, were examined for a loading-dwelling-unloading history. Simulation results showed that the unloading path deviated from the loading path due to the viscoelastic property of the PDMS stamp. The pull-off force increased with the unloading velocity, and the increasing ratio was large at first and then became low. Furthermore, the influence of the preload on increasing the pull-off force was more significant under larger unloading velocity than that under smaller unloading velocity. In addition, the pull-off force increased remarkably with the thermodynamic work of adhesion at a fixed maximum approach.

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Section: Introductionmentioning

confidence: 99%

Investigations on the Adhesive Contact Behaviors between a Viscoelastic Stamp and a Transferred Element in Microtransfer Printing

Jiang

et al. 2021

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Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces

Keshavarzi

Mescheder

Reinecke

2016

J. Microelectromech. Syst.

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Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon

Keshavarzi

Mescheder

Reinecke

2014

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

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Velcro-like (needle like) surfaces b silicon can result in strong permanent b temperature with capability of multiple b bonding similar to Velcro® princi understanding of the interaction mechanism surfaces is crucial for employing this type wafer or chip bonding and IC packing app paper, a simple Si technology to create Vel is described and characterized, and mechanisms between such surfaces are mo Van der Waals force approach.

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Considering Van Der Waals Forces in Micromanipulation Design

Cited by 3 publications

References 14 publications

Investigations on the Adhesive Contact Behaviors between a Viscoelastic Stamp and a Transferred Element in Microtransfer Printing

Investigations on the Adhesive Contact Behaviors between a Viscoelastic Stamp and a Transferred Element in Microtransfer Printing

Room Temperature Si–Si Direct Bonding Technique Using Velcro-Like Surfaces

Characterisation and simulation of low temperature Si-Si direct bonding through velcro-like surfaces based on porous silicon

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