2007
DOI: 10.1116/1.2749527
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Conformal metal thin-film coatings in high-aspect-ratio trenches using a self-sputtered rf-driven plasma source

Abstract: A thin-film coating system has been developed for the deposition of both conductive and insulating materials. The system employs a radio-frequency (rf)-discharge plasma source with four straight rf antennas, which is made of or covered with the deposition material, thus serving simultaneously as a sputtering target. The average deposition rate of the copper thin film can be as high as 500nm∕min when operated under continuous-wave mode. Film properties under different operating conditions (gas pressure and rf p… Show more

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Cited by 10 publications
(4 citation statements)
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“…We observe that both the metasurface and fluoropolymer coatings cover the micropillared substrate uniformly, making them almost indistinguishable from the bare pillars. Especially for the metasurface coating, we used low-pressure and high-power sputtering to promote deposition directionality (see Methods for deposition conditions), which ensures coverage of the bottom of the texture, and also to enhance conformality through metal ion resputtering on the sidewalls of the micropillars . Some submicrometer features on the surface are due to the soft lithography replication process but do not negatively impact its performance.…”
Section: Results and Discussionmentioning
confidence: 76%
See 1 more Smart Citation
“…We observe that both the metasurface and fluoropolymer coatings cover the micropillared substrate uniformly, making them almost indistinguishable from the bare pillars. Especially for the metasurface coating, we used low-pressure and high-power sputtering to promote deposition directionality (see Methods for deposition conditions), which ensures coverage of the bottom of the texture, and also to enhance conformality through metal ion resputtering on the sidewalls of the micropillars . Some submicrometer features on the surface are due to the soft lithography replication process but do not negatively impact its performance.…”
Section: Results and Discussionmentioning
confidence: 76%
“…Especially for the metasurface coating, we used low-pressure and high-power sputtering to promote deposition directionality (see Methods for deposition conditions), which ensures coverage of the bottom of the texture, and also to enhance conformality through metal ion resputtering on the sidewalls of the micropillars. 54 Some submicrometer features on the surface are due to the soft lithography replication process but do not negatively impact its performance. (For more information on the superhydrophobic control surface, see Supporting Information, section "Topography of the control", and Figure S1.)…”
Section: Resultsmentioning
confidence: 99%
“…The Au/Pd does not coat the entire depth of the trench sidewalls since sputtering processes tend to be nonconformal in high-aspect-ratio features. [37] Upon contact of the two gold layers, the contacting area, which is necessary for charge conduction, is small.…”
Section: Integration Of P4vp Into Trenchesmentioning
confidence: 99%
“…To extend the applicability of PVD to the next generations of IC manufacturing, there exist several technical methods of reducing the shadowing effect. [2][3][4] The formation of overhang occurs when the deposited atoms accumulate on the top opening of the trench. To reduce the formation of the overhang by improving the mobilities of adatoms over a substrate with a certain packed structure can be effective.…”
Section: Introductionmentioning
confidence: 99%