2021
DOI: 10.1002/adma.202005672
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Conformal Geometry and Multimaterial Additive Manufacturing through Freeform Transformation of Building Layers

Abstract: 3D printing, formally known as additive manufacturing, creates complex geometries via layer‐by‐layer addition of materials. While 3D printing has been historically perceived as the static addition of build layers, 3D printing is now considered as a dynamic assembly process. In this context, here a new 3D printing process is reported that executes full degree‐of‐freedom (DOF) transformation (translating, rotating, and scaling) of each individual building layer while utilizing continuous fabrication techniques. … Show more

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Cited by 21 publications
(12 citation statements)
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“…The molten filament is printed by the nozzle in the x-y plane according to the printing speed, printing path, printing temperature and other parameters set in the STL file [2]. The final 3D model is formed by overlaying the layered information along the z-axis of the printer [3]. FDM technique is widely used because of its advantages such as adaptability of printing materials [4,5], easy maintenance of printing devices [6], low environmental pollution [7], and space-saving [8].…”
Section: Introductionmentioning
confidence: 99%
“…The molten filament is printed by the nozzle in the x-y plane according to the printing speed, printing path, printing temperature and other parameters set in the STL file [2]. The final 3D model is formed by overlaying the layered information along the z-axis of the printer [3]. FDM technique is widely used because of its advantages such as adaptability of printing materials [4,5], easy maintenance of printing devices [6], low environmental pollution [7], and space-saving [8].…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, through electrophoresis, the amount of materials on surface of particle can be precisely obtained. Nonetheless, the dynamic kinetics in the encapsulation process could still influence the results more or less [142].…”
Section: Interactions On Colloidal Particlesmentioning
confidence: 99%
“…The interconnects favour using copper because it has very low resistivity, resulting in negligible voltage drops despite micrometre-level thickness; for 3D-printed materials with a high resistivity value to be viable, the interconnect should have a large cross-sectional area or/and short length which will limit their applications to lowdensity circuitry. For passive components, on the other hand, AM may diversify existing two-dimensional geometries by printing unusual shapes or conformal patterns onto any curvilinear surfaces [91,92]. Researchers have been able to manufacture all basic circuit components including resistors (R), inductors (L), and capacitors (C) that can be combined to function as filters or antennas (LC tanks); these components along with conducting traces are mounted on the surface of a circuit board.…”
Section: Resistance Inductance Capacitancementioning
confidence: 99%