The redistribution of the p-type dopant Be during the post-growth rapid thermal annealing in InGaAs layers grown by gas source molecular beam epitaxy has been studied using secondary ion mass spectrometry technique. The experimental structures consisted of a 2000 Å Be-doped (3 × 10 19 cm −3 ) In0.53Ga0.47As layer sandwiched between 5000 Å undoped In0.53Ga0.47As layers. To explain the observed depth profiles, obtained for annealing cycles with time durations of 10 to 240 s and temperatures in the range of 700-900 • C, two models of kick-out mechanism, with neutral and singly positively ionized Be interstitial species, have been considered.Introduction. -One of the most likely acceptor dopants used in InP/InGaAs Double Heterojunction Bipolar Transistors (DHBTs) is beryllium. Although Be can attain high doping levels (due to its high solubility and high sticking coefficient [1]), it is limited by its concentration-dependent diffusivity [2-4], which at high doping levels of Be in InGaAs base may significantly degrade device performance. Consequently, in order to improve transistor performance, accurate simulation of Be diffusion is important.The subject of this work is the modelling and simulation of Be diffusion during post-growth rapid thermal annealing (RTA) in In 0.53 Ga 0.47 As layers grown by gas source molecular beam epitaxy (GSMBE) for InP/InGaAs DHBT applications.The diffusion of grown-in Be in InGaAs epilayers has been studied by several authors [2-6]. The variations on the substitutional-interstitial diffusion mechanism (SID) have been put forward to account for the data [2,3,6]. It has been found that the post-growth redistribution of Be in InGaAs depends on epitaxial growth conditions, such as: III-V flux ratio [2], strain layer yield [4,5] and growth temperature [6]. Experimental procedure. -The experimental samples are InP-based epitaxial structures grown by GSMBE. They consist of a 2000 Å Be-doped (3 × 10 19 cm −3 ) In 0.53 Ga 0.47 As layer