Conduction Path Formation Mechanism of Solderable Polymer Composites with Low-Melting-Point Alloy/High-Melting-Point Alloy Mixed Filler

Abstract

A novel interconnection mechanism using a solderable polymer composite (SPC) with a low-melting-point alloy (LMPA)/high-meltingpoint alloy (HMPA) mixed filler was proposed to enhance the properties of the LMPA filler and establish a conduction path containing the HMPA filler. To investigate the feasibility of the proposed interconnection mechanism, three types of SPC with a different mixing ratios of LMPA/HMPA filler (100:0, 50:50, and 0:100) were formulated. The SPC with only an HMPA filler showed weak conduction path formation due to excessive curing of the polymer composite before melting of the HMPA filler. In contrast, the SPC with an LMPA/HMPA mixed filler formed a stable and wide conductive path due to the suitable flow-coalescence-wetting behaviors of the molten LMPA filler containing solidstate HMPA filler, which came into effect before excessive curing of the polymer composite.

Size-Controlled Low-Melting-Point-Alloy Particle-Incorporated Transient Liquid-Phase Epoxy Composite Conductive Adhesive with High Performances

“…41 Therefore, the XPS results indicated that the major components of the surface oxide of Bi-In-Sn LMPA particles were Sn oxide and Bi oxide. To reduce the influence of the surface oxide layer of LMPA particles on the performance of the TLP-ECAs, it was necessary to add carboxylic acid, as the reducing agent, 42,43 into the ingredients of the TLP-ECAs.…”

Mechanical Properties of Solderable Polymer Composites with Low- and High-Melting-Point Solder Mixed Filler

“…6) In previous work, our research team developed and reported a novel concept for an SPC system containing LMPS and high-melting-point solder (HMPS) fillers to overcome potential issues of SPC joints formed using the Sn58Bi solder filler. 7) The conduction path formation mechanism of SPC filled with LMPS/HMPS mixed fillers is illustrated in Fig. 1.…”