When a crack propagates towards a weak interface, interface debonding may occur before the incident crack reaches the interface. This phenomenon refers to the ''Cook-Gordon mechanism''. In this investigation, an equivalent dynamic CookGordon mechanism is studied both experimentally and analytically. Two strength-based criteria incorporating dynamic fracture mechanics analysis are proposed to predict the initiation location of interface debonding ahead of a dynamic incident crack. As validation, a comparison is made between the analytical predictions and experimental measurements. Results show that the strength-based criteria can effectively predict the initiation of interface debonding. Meanwhile, effects of the stress intensity factor and the T stress of the incident crack, on the interfacial debonding initiation are investigated. It is concluded that high-stress intensity factors of the incident cracks will easily induce interfacial debonding initiation, and changing the T stress is an effective way to control interfacial debonding initiation. Furthermore, high-interfacial tensile strengths rather than shear strengths, tend to suppress interfacial debonding initiation induced by a mode-I incident crack.