Abstract:We present a computational study of processes taking place in a sheath region formed near a negatively biased uneven substrate during ionized plasma vapour deposition. The sputtered metal atoms are ionized on their way to substrate and they are accelerated in the sheath near the substrate. They are able to penetrate to high-aspect-ratio structures, for example, trenches, which can be, therefore, effectively coated. The main technique used was a two-dimensional particle simulation. The results of our model pred… Show more
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