Computer-aided inspection for substrate design

Abstract

Substrate design is one of the major tasks involved in packaging design. In current business practice, the circuits of a substrate design are mostly designed by professional designers and produced by suppliers. Due to manufacturing limitations, some features of the circuit need to be modified before manufacturing. The original design and the modified design must be compared in order to ensure the desired functions. However, the circuits of a substrate design are highly complex and embedded in several physical layers. This makes the comparison task difficult, even for experienced individuals.The aim of this research is to develop an effective computer-aided inspection approach to decrease the design cost and lead time for substrate design. Three procedures and a knowledge base are developed to identify, categorise, and compare the information extracted from a substrate design drawing. First a feature extraction procedure was developed to search the related information in the data exchange format (DXF) file. Important features such as width and position of traces and vias are extracted from the original and modified designs of a substrate and are classified into three categories. The proposed feature comparison procedure is then used to compare the classified features with the assistance of a pre-defined knowledge base. Finally, the difference between the original and modified designs is marked with diverse colours and restored in a new DXF file.

Experimental Study of the Small Lubrication Holes on the Die Shoulder on the Formability in Cylindrical Cup Deep-Drawing

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The Study of Automatic Programming System for Near-Field Electrospinning Direct Write

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