2016
DOI: 10.1016/j.applthermaleng.2015.10.069
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Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications

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Cited by 20 publications
(16 citation statements)
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“…The analysis was carried with various ambient temperatures such as 25°C, 50°C and 80°C and at various HPLED power dissipations such as 0.5W, 0.75W, 1W and 1.25 W respectively. The author confirmed that including an aluminum or copper plate behind the PCB at lower ambient temperature is adequate to operate the HPLED [7]. Using a high power COB (chip on board) HPLED, Badalan et.…”
Section: Introductionmentioning
confidence: 87%
“…The analysis was carried with various ambient temperatures such as 25°C, 50°C and 80°C and at various HPLED power dissipations such as 0.5W, 0.75W, 1W and 1.25 W respectively. The author confirmed that including an aluminum or copper plate behind the PCB at lower ambient temperature is adequate to operate the HPLED [7]. Using a high power COB (chip on board) HPLED, Badalan et.…”
Section: Introductionmentioning
confidence: 87%
“…The morphological, structural and optical properties were studied for different RE ions (Tm 3þ , Tb 3þ and Sm 3þ ) doped YWO samples. 2 ) which are purchased from Sigma Aldrich Co., South Korea. All the chemicals were of analytical grade and were used as received without any further purification.…”
Section: Introductionmentioning
confidence: 99%
“…This resulted in using LED in airfield, runway and taxiway lighting systems [5]. Sokmen et al [6] studied the effects of fin design, fin material, and free and forced convection on junction temperature in automotive headlamp cooling applications of LED lights using ANSYS CFX 14 software. Furthermore, a new methodology was developed to define the optimum cylindrical fin structure within the given limits.…”
Section: Introductionmentioning
confidence: 99%