This
paper demonstrates laser forming, localized heating with a
laser to induce plastic deformation, can self-fold 2D printed circuit
boards (PCBs) into 3D structures with electronic function. There are
many methods for self-folding but few are compatible with electronic
materials. We use a low-cost commercial laser writer to both cut and
fold a commercial flexible PCB. Laser settings are tuned to select
between cutting and folding with higher power resulting in cutting
and lower power resulting in localized heating for folding into 3D
shapes. Since the thin copper traces used in commercial PCBs are highly
reflective and difficult to directly fold, two approaches are explored
for enabling folding: plating with a nickel/gold coating or using
a single, high-power laser exposure to oxidize the surface and improve
laser absorption. We characterized the physical effect of the exposure
on the sample as well as the fold angle as a function of laser passes
and demonstrate the ability to lift weights comparable with circuit
packages and passive components. This technique can form complex,
multifold structures with integrated electronics; as a demonstrator,
we fold a commercial board with a common timing circuit. Laser forming
to add a third dimension to printed circuit boards is an important
technology to enable the rapid prototyping of complex 3D electronics.