Compression plasma flows modification of surface layers in the system “Ti–Si”: Phase composition, structure and element redistribution

Effect of Compressed Plasma Flow on Tantalum-Titanium Thin Layer Deposited on Silicon Substrate

“…This later reduction can be connected to both an increase in the ablated titanium and tantalum atoms together, and more homogeneous Ti distribution with depth. This claim has been previously confirmed that an increase in energy density leads to thickening of molten layer depth [17]. Increase in energy density to E 2 results in the formation of nanosized spherical particles (Fig.…”

“…In our previous study, CPF interaction with Ta/Si and Ti/Si systems were individually reported [17,22]. In CPF treatment of Ti/Si [17], Ti 5 Si 3 was formed after CPF action.…”

“…The CPF can be used as a surface alloying tool capable of processing a coating/substrate system (e.g., a 1-5 µm thick film deposited on a substrate). In this process, a deep alloying of the substrate (~10 -25 µm) by elements of the coating can be achieved, with solid solutions and chemical compounds being made between elements of the substrate and the coating [15][16][17][18]. The resulting surface properties are unlikely to be reproduced by available techniques.…”

“…Among the broad range of research areas related to the use of CPF, particular interest is being shown in the creation of new materials based on silicon, namely, metal silicides [16,17,19]. Silicides are widely used in micro and nano and optoelectronics and are applied as catalysts in the formation of nanotubes.…”

“…In CPF treatment of Ti/Si [17], Ti 5 Si 3 was formed after CPF action. This silicide was present overall range of used energy density.…”