Abstract:A comprehensive thermal model for an electro-thermal-compliant (ETC) microactuator is presented in this paper. The model accounts for all modes of heat dissipation and the temperature dependence of thermophysical and heat transfer properties. The thermal modelling technique underlying the microactuator model is general and can be used for the virtual testing of any ETC device over a wide range of temperatures (300-1500 K). The influence of physical size and thermal boundary conditions at the anchors, where the… Show more
“…Physical modelling of such devices poses many difficulties, one of the most significant being that the thermal, electrical, and mechanical domains are coupled with one another. Nonetheless, many researchers have produced models of varying complexity [4][5][6][7][8][9][10][11]. In order to accommodate the large spatial variations in properties, the use of finite element analysis (FEA) software packages in such models is common [10], as are highly elaborate analytical models that solve for spatially distributed parameters, resulting in a large number of simultaneous equations [8]- [9].…”
-In the present work, a dimensional analysis of hot-arm actuation is performed. Several dimensionless pi groups result, including the Biot number; a thermo-electro parameter combining voltage, electrical resistivity, and thermal expansion coefficient; and a number of geometric parameters. The dimensional analysis proves that there is no way to incorporate the dimensions of Young's modulus in the problem, verifying suspicions voiced in a small number of earlier works. Furthermore, the thermo-electro parameter validates the results of many models and experiments in which deflection is directly proportional to both the thermal expansion coefficient and the square of the applied voltage. Lastly, the small Biot numbers (0.001 < Bi < 0.2) encountered in hot arm actuators indicate that a lumped-element approach to thermal modelling is legitimate, and therefore capable of producing accurate results.
“…Physical modelling of such devices poses many difficulties, one of the most significant being that the thermal, electrical, and mechanical domains are coupled with one another. Nonetheless, many researchers have produced models of varying complexity [4][5][6][7][8][9][10][11]. In order to accommodate the large spatial variations in properties, the use of finite element analysis (FEA) software packages in such models is common [10], as are highly elaborate analytical models that solve for spatially distributed parameters, resulting in a large number of simultaneous equations [8]- [9].…”
-In the present work, a dimensional analysis of hot-arm actuation is performed. Several dimensionless pi groups result, including the Biot number; a thermo-electro parameter combining voltage, electrical resistivity, and thermal expansion coefficient; and a number of geometric parameters. The dimensional analysis proves that there is no way to incorporate the dimensions of Young's modulus in the problem, verifying suspicions voiced in a small number of earlier works. Furthermore, the thermo-electro parameter validates the results of many models and experiments in which deflection is directly proportional to both the thermal expansion coefficient and the square of the applied voltage. Lastly, the small Biot numbers (0.001 < Bi < 0.2) encountered in hot arm actuators indicate that a lumped-element approach to thermal modelling is legitimate, and therefore capable of producing accurate results.
“…Temperature dependent values of density and thermal conductivity of air are taken from Mills [12], as well as formulae for the convection coefficient for macro systems, which are extrapolated to the micro domain. For the radiation estimation, the structures are modelled as grey bodies with an emissivity of 0.7 [9,13].…”
This paper presents an improved thermal actuator design, providing high work per unit of chip area. The actuator was developed for high accuracy fibre alignment. This application requires that the fibre tip is moved by pushing close to its end, posing geometric design constraints on the actuator design. The basic structure of the actuator is a parallelogram, consisting of a non-moving base, a bar parallel to the base placed orthogonal to the fibre axis in contact with the fibre, and heater arms and reinforced restraining arms which connect the base and the bar. The heater arms thermally expand when passing a current through them. On either side of the heater arms there is one restraining arm, placed at a slightly different angle with the base and bar than the heater arms. The restraining arms do not heat up, and constrain the motion due to thermal expansion of the heater arms, resulting in a motion of the bar in its longitudinal direction. The performance of this actuator is compared to two well-known alternative thermal actuator configurations. Comparison shows that the improved actuator delivers 15% more work per area, and is therefore considered an attractive alternative solution for purposes such as in-plane optical fibre alignment.
“…Numerous research groups have developed numerical models of thermal microactuator performance Bergna et al, 2005;Enikov et al, 2005;Howell et al, 2007;Lott et al, 2002;Mankame and Ananthasuresh, 2001;Serrano et al, 2006;and Wong and Phinney, 2007). These models include electrical, thermal, and mechanical effects and are implemented through finite difference as well as finite element approaches.…”
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