Comprehensive properties study of low-temperature imidized polyimide with curing accelerators

Huang, Chao; Li, Jinhui; Sun, Deliang; Xuan, Rui; Sui, Yuying; Li, Tingyu; Shang, Liang; Zhang, Guoping; Sun, Rong; Wong, C.P.

doi:10.1039/d0tc03770b

Cited by 27 publications

(25 citation statements)

References 38 publications

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“…The initial poly(amic acid) synthesis was performed in NMP at room temperature. Quinoline was added to the reaction mixture to serve as an imidization accelerator, 46 allowing the conversion to imide to occur at lower temperatures, and the reaction was heated to 180 °C with the removal of water as a toluene azeotrope to produce PEI‐PDADMA(PF 6 ). Copolymer compositions were determined by integrating the characteristic DADMA(PF 6 ) peaks and comparing values to those of the methyl proton peaks from the BPA‐type linkages (Figures 6 and S22–S24).…”

Section: Resultsmentioning

confidence: 99%

Synthesis and properties of cationic multiblock polyaramides and polyimides

Biery

Knauss

2022

Journal of Polymer Science

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Poly(diallyldimethylammonium chloride) (PDADMAC) is a useful material due to its high charge density and alkaline stability, but its hydrophilic nature limits applications to those where the dissolved polymer is appropriate. To make polymers suitable for applications as films and membranes containing the diallyldimethylammonium moiety, multiblock copolymers of polyaramides (PA) and polyimides (PI), materials known for their excellent physical properties and stabilities, were synthesized. Aminophenyl difunctionalized PDADMAC oligomers were synthesized using a disulfide iniferter then counterion exchanged to the hexafluorophosphate anion to produce telechelic oligomers with good solubility in polar aprotic solvents. The oligomers were reacted in situ with the proper difunctional monomers to produce PA, polyetheraramides, PI, and polyetherimides. All the classes of copolymers were synthesized over a range of compositions at high yield and material properties were demonstrated to be a result of both the backbone chemistry and the composition. Several of the synthesized copolymers formed films with good clarity, strength, and flexibility. The copolymers containing ether linkages had increased backbone flexibility and demonstrated better film‐forming properties. The multiblock copolyaramides and copolyimides demonstrate a method to produce materials with excellent thermal stability and good strength and flexibility, making them uniquely capable of serving as water insoluble, cationic films, and membranes.

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Section: Resultsmentioning

confidence: 99%

Synthesis and properties of cationic multiblock polyaramides and polyimides

Biery

Knauss

2022

Journal of Polymer Science

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“…Meanwhile, the relationship between tensile strength and ID are characterized in Figure 4b; the changes in the tensile strength and the ID of PI films with different chemical catalytic reagents show a consistent trend. The index of ID strongly correlates with the degree of in-plane orientation, mechanical strength, and thermal properties of PI film [41]. It can be concluded that the high tensile strength of PI films is attributed to the high imide degree and ordered aggregation phase.…”

Section: Structure and Properties Of Pi Filmsmentioning

confidence: 94%

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

Sun

Wang

et al. 2022

Nanomaterials

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With the large-scale application and high-speed operation of electronic equipment, the thermal diffusion problem presents an increasing requirement for effective heat dissipation materials. Herein, high thermal conductive graphite films were fabricated via the graphitization of polyimide (PI) films with different amounts of chemical catalytic reagent. The results showed that chemically imidized PI (CIPI) films exhibit a higher tensile strength, thermal stability, and imidization degree than that of purely thermally imidized PI (TIPI) films. The graphite films derived from CIPI films present a more complete crystal orientation and ordered arrangement. With only 0.72% chemical catalytic reagent, the graphitized CIPI film achieved a high thermal conductivity of 1767 W·m−1·K−1, which is much higher than that of graphited TIPI film (1331 W·m−1·K−1), with an increase of 32.8%. The high thermal conductivity is attributed to the large in-plane crystallite size and high crystal integrity. It is believed that the chemical imidization method prioritizes the preparation of high-quality PI films and helps graphite films achieve an excellent performance.

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“…1,8-diazabicyclo [5.4.0] undec-7-ene (DBU) was also effective to reduce the imidization temperature of PAA to 200 °C [ 23 , 24 ]. Huang C. et al [ 25 ] have investigated the mechanical, thermal, and electrical properties of the polyimide films derived from the imidization of PAA catalyzed by quinoline (QL) and quinoline derivatives. Sui, Y.Y.…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties

et al. 2023

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Low-temperature curable negative-tone photosensitive polyimide (n-LTPI) viscous solutions were prepared by dissolving photo-crosslinkable poly (amic ester) (pc-PAE) resin, photophotocrosslinker, photoinitiator, and the heteroaromatic base as curing catalysts, and other additives in organic solvents. Among them, the pc-PAE resin was synthesized by polycondensation of aromatic diacid chloride and diester of 2-ethoxymathacrylate, aromatic diamines in aprotic solvents. After being spun-coated on a silicon wafer surface, soft-baked, exposed to UV light, and developed, the n-LTPI with 2% of imidazole (IMZ) as a curing catalyst produced high-quality photo-patterns with line via resolution of 5 μm at 5 μm film thickness. The photo-patterned polymer films thermally cured at 230 °C/2 h in nitrogen showed 100% of the imidization degree (ID) determined by in situ FT-IR spectroscopy. The thermally cured polymer films exhibited great combined mechanical and thermal properties, including mechanical properties with tensile strength of as high as 189.0 MPa, tensile modulus of 3.7 GP, and elongation at breakage of 59.2%, as well as glass transition temperature of 282.0 °C, showing great potential in advanced microelectronic packaging applications.

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Comprehensive properties study of low-temperature imidized polyimide with curing accelerators

Abstract: Low temperature curing polyimide (PI) has become a significant target for the advanced electronic package recently. Even though curing accelerators which could significantly reduce the curing temperature have been proved,...

Cited by 27 publications

References 38 publications

Synthesis and properties of cationic multiblock polyaramides and polyimides

Synthesis and properties of cationic multiblock polyaramides and polyimides

Highly Thermal Conductive Graphite Films Derived from the Graphitization of Chemically Imidized Polyimide Films

Low-Temperature Curable Negative-Tone Photosensitive Polyimides: Structure and Properties

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