Comprehensive material study of Ge grown by aspect ratio trapping on Si substrate

Abstract

High-quality monolithic Ge-on-Si is sought for CMOS-compatible optoelectronic devices. We examine the structural characteristics of Ge-on-Si grown by the aspect ratio trapping (ART) method on a SiO2/Si(001) template in pre-patterned holes. Transmission electron microscopy and surface topography analysis revealed high-quality Ge islands overgrown from the ART holes in SiO2. The superior crystal quality of Ge ART growth was also confirmed by comparing X-ray diffraction (XRD) data of Ge ART and Ge planar epilayer samples. The XRD and micro-Raman data additionally show a small residual strain in the islands which vanishes by reducing the hole diameter from 280 nm to 180 nm, while leading to only a minor increase in the crystallographic inclinations of the Ge islands from 0.34 deg to 0.54 deg. With finite element method simulations, we find that the small residual strain in Ge originates during the cool-down from growth to room temperature because of thermal expansion coefficient mismatch between Ge and SiO2. A tensile force develops along the [001] axis of the Ge pillar whose faster shrinkage to the room temperature volume is restricted by the oversized surface island.