2023
DOI: 10.1088/1361-6528/ad0127
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Complex role of strain engineering of lattice thermal conductivity in hydrogenated graphene-like borophene induced by high-order phonon anharmonicity

Jia He,
Cuiqian Yu,
Shuang Lu
et al.

Abstract: Strain engineering has been used as a versatile tool for regulating the thermal transport in various materials as a result of the phonon frequency shift. On the other hand, the phononic bandgap can be simultaneously tuned by the strain, which can play a critical role in wide phononic bandgap materials due to the high-order phonon anharmonicity. In this work, we investigate the complex role of uniaxial tensile strain on the lattice thermal conductivity of hydrogenated graphene-like borophene, by using molecular… Show more

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Cited by 7 publications
(2 citation statements)
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“…Ren et al studied the effect of moiré superlattice on heat transport in van der Waals heterojunctions and found that the moiré effect can flexibly regulate heat flow by affecting the atomic stress amplitude. He et al explored the complex role of strain engineering in regulating the lattice thermal conductivity of hydrogenated graphene-like borophene and found that strain applied in both armchair and zigzag directions can increase the anisotropy of thermal conductivity. In this study, we examined the impact of tensile and compressive strains on the heat flux and TR of GR-BNNTs, as depicted in Figure a.…”
Section: Resultsmentioning
confidence: 99%
“…Ren et al studied the effect of moiré superlattice on heat transport in van der Waals heterojunctions and found that the moiré effect can flexibly regulate heat flow by affecting the atomic stress amplitude. He et al explored the complex role of strain engineering in regulating the lattice thermal conductivity of hydrogenated graphene-like borophene and found that strain applied in both armchair and zigzag directions can increase the anisotropy of thermal conductivity. In this study, we examined the impact of tensile and compressive strains on the heat flux and TR of GR-BNNTs, as depicted in Figure a.…”
Section: Resultsmentioning
confidence: 99%
“…The mechanisms involved include the competition between group velocity and higher‐order phonon scattering. [ 51 ] In conclusion, the aforementioned methods hold promise for overcoming the negative substrate effects on heat transport in electronic devices.…”
Section: Introductionmentioning
confidence: 99%