FinFΔT SNWFT is being considered as the candidate for CMOS scaling beyond the nm node due to its high performance, excellent gate control and enhanced carrier transportation properties. Thin and multi-gate controlled body provide FinFΔTs a superior short-channel effect control, electrostatic shielding from the body bias, relaxing channel doping or pocket implants, commonly needed in planar technologies to avoid threshold voltage V TH roll-off [ ]. Adequate device V TH is now being achieved by using gate stack engineering. MetalGates with High-k HKMG dielectric stacks provide the desired V TH by work-function tuning as well as preserving low gate leakage [ ]. Various process options are being attempted to affect carrier transport in a different manner. The use of metal gates as replacement for Poly-Si stacks eliminates the Poly-depletion effect, benefiting effective carrier mobility by reducing the transverse field [ ]. Additionally, use of undoped channels improves low-field μ eff due to the reduction in the substrate impurity scattering [ ]. Mobility degradation due to Coulomb scattering in short-channel devices should further be reduced in the absence of pocket implants [ ]. However, high-k dielectrics are known to degrade mobility as a result of a combination of Coulomb and phonon scattering mechanisms [ ]. In order to account for inversion layer mobility degradation mechanisms for FinFΔT devices, a robust μ eff extraction algorithm is necessary. The mobility extraction requires accurate measurement of both gate to channel capacitance and channel current, together with reliable estimations for the parasitic Source-Γrain series resistance R SΓ and the effective channel length [ ]. Unfortunately, the capacitance of short-channel length devices in the presence of large gate leakage is no longer characterized trivially. In multi-gate architectures like the FinFΔT, the carrier transport occurs in different crystallographic planes. For standard substrates, the current flow occurs in the / for the top surface and / for the sidewalls. The transport in these crystal planes and directions are characterized by different mobility primarily due to the anisotropy of the effective masses.The most promising among various Si multi-gate MOSFΔT architectures such as double-gate and tri-gate FinFΔTs, are nanowire FinFΔTs due to their superior electrostatic control through gate-all-around structure. Superior gate control, immunity of threshold voltage from substrate bias and excellent carrier transport properties along with more aggressive channel length scaling possibility have made GAA architecture with semiconductor nanowire channel a potential candidate for post-planar transistor design. Two approaches are generally used to fabricate Si NWs as well as other semiconductor NWs bottom-up and topdown. In the first method, NWs are usually grown using a metallic catalyst on a separate substrate, usually through a Vapor-Liquid-Solid VLS growth mechanism. After a chemical or mechanical separation step, the NWs are harvested and trans...