2017
DOI: 10.1126/sciadv.aao1472
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Complex dewetting scenarios of ultrathin silicon films for large-scale nanoarchitectures

Abstract: Si-based nanoarchitectures are formed with unprecedented precision and reproducibility via templated dewetting of thin SOI.

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Cited by 91 publications
(102 citation statements)
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“…One viable and promising route is solid-state dewetting of ultra-thin films of metals 18,[34][35][36][37][38][39][40][41] and semiconductors, [42][43][44][45][46] a natural phenomenon exploited for the self-assembly of high-quality photonic structures. The instability giving rise to the dewetting phenomenon in thin films is mediated by the surface diffusion of atoms and occurs upon annealing at high temperature (even well below the melting point of the material) [47][48][49][50][51][52][53][54][55][56][57][58] .…”
Section: Introductionmentioning
confidence: 99%
“…One viable and promising route is solid-state dewetting of ultra-thin films of metals 18,[34][35][36][37][38][39][40][41] and semiconductors, [42][43][44][45][46] a natural phenomenon exploited for the self-assembly of high-quality photonic structures. The instability giving rise to the dewetting phenomenon in thin films is mediated by the surface diffusion of atoms and occurs upon annealing at high temperature (even well below the melting point of the material) [47][48][49][50][51][52][53][54][55][56][57][58] .…”
Section: Introductionmentioning
confidence: 99%
“…Top panels: dark-field optical microscope (100×magnification, NA=0.75) of monocrystalline Si islands on 25 nm BOX. From the left to the right, panels are illustrated with several islands organization obtained from different initial patch size and shape [31,35]. Bottom panels: same as the top panels for islands transferred in a PDMS slice.…”
Section: Discussionmentioning
confidence: 99%
“…We now take into account the case of templated dewetting of commercial UT-SOI: [31,35] by changing the etched patch size and shape (e.g. simple squares, squares with a central cross, parallel trenches) we obtain different arrangement of the Si particles sitting on a 25nm thick BOX ( figure 6 top panels).…”
Section: Methods B: Transfer In Pdms Slicesmentioning
confidence: 99%
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