Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison

Lee, Tae-Kyu; Park, Yujin; Ramakrishna, Gnyaneshwar; Nam, Jonghyun; Yoon, Daljin; Roh, Heera

doi:10.1109/ectc51529.2024.00181

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00181

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Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison

Tae-Kyu Lee,

Yujin Park,

Gnyaneshwar Ramakrishna

et al.

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Complex board via structure induced uneven stress/strain impact on interconnect stability: SAC305, full and hybrid LTS comparison

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