Complete sputtering metallization for high-volume manufacturing

Radulescu, Fabian; Miller, Paul L.; Cunnane, Liam; Harris, Michael L.; Lam, Hien; Bowers, C. Edward

doi:10.1016/s0961-1290(02)85149-3

Cited by 5 publications

(5 citation statements)

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“…PVD films are high-purity, environment-friendly, and compatible with most materials and substrates. These attributes render PVD highly sought after in electronic/optical coatings and material enhancement [ 40 , 41 ]. PVD methods for preparing metal-oxide materials encompass magnetron sputtering, laser deposition, ion beam deposition, molecular beam epitaxy, thermal evaporation, etc.…”

Section: Metal-oxide Heterojunctionmentioning

confidence: 99%

Metal-Oxide Heterojunction: From Material Process to Neuromorphic Applications

Diao,

Zhang,

et al. 2023

Sensors

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As technologies like the Internet, artificial intelligence, and big data evolve at a rapid pace, computer architecture is transitioning from compute-intensive to memory-intensive. However, traditional von Neumann architectures encounter bottlenecks in addressing modern computational challenges. The emulation of the behaviors of a synapse at the device level by ionic/electronic devices has shown promising potential in future neural-inspired and compact artificial intelligence systems. To address these issues, this review thoroughly investigates the recent progress in metal-oxide heterostructures for neuromorphic applications. These heterostructures not only offer low power consumption and high stability but also possess optimized electrical characteristics via interface engineering. The paper first outlines various synthesis methods for metal oxides and then summarizes the neuromorphic devices using these materials and their heterostructures. More importantly, we review the emerging multifunctional applications, including neuromorphic vision, touch, and pain systems. Finally, we summarize the future prospects of neuromorphic devices with metal-oxide heterostructures and list the current challenges while offering potential solutions. This review provides insights into the design and construction of metal-oxide devices and their applications for neuromorphic systems.

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Section: Metal-oxide Heterojunctionmentioning

confidence: 99%

Metal-Oxide Heterojunction: From Material Process to Neuromorphic Applications

Diao,

Zhang,

et al. 2023

Sensors

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“…12,13 Unlike sputtered Au, evaporated Au has a more uniform grain structure, making it more stable. The thermal conductivity κ of bulk Au as a function of temperature T is 14…”

Section: Interconnect Metalsmentioning

confidence: 99%

Electro-thermal resistance of GaAs interconnects

Wartenberg¹,

Zhao

Liu

2005

Journal of Elec Materi

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This paper describes the effect of steady-state heating on the electrical and thermal resistance of interconnects on GaAs. Examined is a typical dual-layer metal interconnect system, common to GaAs processing. The interconnect system is considered in three parts, the interconnect metals, the Si 3 N 4 dielectric surrounding the metal, and the Al x Ga 1-x As epitaxial substrate. Using a meandering line as a test structure, measurements show how the direct current (DC) resistance increases with both temperature and dissipated power. Thermal resistors are proposed to account for self-heating and thermal coupling.

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“…The primary metallization is done through different methods including electroless plating, brushing a metal paint, spray metal technique, dipping in a metal paint, sputtering and vacuum metallization etc. [1][2]. Each process has its own merits and demerits in terms of economic, user friendly and complexity.…”

Section: Introductionmentioning

confidence: 99%

Electroplating of FDM Parts: A comparison via two different routes

Equbal¹

2021

Advanced Materials Proceedings

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Present paper compares the copper electroplating on FDM (Fused deposition modelling) parts through two different routes. The two routes are: (i) Method of electroplating using chromic acid for surface preparation (ii) Method of electroplating using aluminium charcoal (Al-C) paste for surface preparation. Same plating condition is used for both the routes adapted. The result proposes that better copper deposition occurs using the Al-C paste than method using chromic acid for surface preparation. However, it was observed that in few samples, problem of shell cracking occurs in Al-C route, the reason for which is dissolution of paste at high operating condition during electroplating. Finally, the conclusion was made that Al-C paste at suitable operating conditions can be used for electroplating of FDM processed ABS parts.

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Complete sputtering metallization for high-volume manufacturing

Cited by 5 publications

References 0 publications

Metal-Oxide Heterojunction: From Material Process to Neuromorphic Applications

Metal-Oxide Heterojunction: From Material Process to Neuromorphic Applications

Electro-thermal resistance of GaAs interconnects

Electroplating of FDM Parts: A comparison via two different routes

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