1996
DOI: 10.1016/0038-1101(95)00166-2
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Complementary heterostructure FET technology for low power, high speed digital applications

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Cited by 15 publications
(9 citation statements)
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“…The fabrication process has been described elsewhere [6]. A test chip consisting of individual transistors and test structures was submitted along with the serializer in order to be able to extract transistor parameters.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The fabrication process has been described elsewhere [6]. A test chip consisting of individual transistors and test structures was submitted along with the serializer in order to be able to extract transistor parameters.…”
Section: Resultsmentioning
confidence: 99%
“…The actual implementation of the logic described for makes use of feedback FET logic (FFL) [6]. An FFL inverter is shown in Fig.…”
Section: To Prevent Thismentioning
confidence: 99%
“…Due to the proprietary nature of the complementary GaAs parameters, Table 1 lists the composite set of HSPICE (level 3, JFET) parameters based on a number of complementary GaAs processes, including Honeywell [4], Sandia [5], University of Lille [6] and MIT [7].…”
Section: Choice Of Gaas Technologymentioning
confidence: 99%
“…Furthermore, the co-integration of n-and p-channel HFETs has attracted considerable attention for extremely low power dissipation associated with complementary logic circuit applications [7][8][9]. In this article, the InGaP/InGaAs/GaAs integrated complementary DCFETs are well reported and demonstrated.…”
Section: Introductionmentioning
confidence: 99%