The interaction of deposited metals with monolayer films is critical to the understanding of, and ultimate
utility of, the emerging arena of molecular electronics. We present the results of a thorough study of the
interaction of vapor-deposited Au and Ag on alkane films attached to Si substrates. Two distinct categories
of films are studied: C18 films formed from the hydrosilation reaction of octadecyl trichlorosilane with thin
SiO2 layers and C18 films formed from the direct attachment of functionalized alkanes with hydrogen-terminated
Si. Two direct attachment chemistries were studied: (Si)3−Si−O−C linkages of 1-octadecanol and octadecanal
on H-terminated Si(111) and (Si)3−Si−C linkages of 1-octadecene on H-terminated Si(111). The reactivity
of the films was studied with p-polarized backside reflection absorption spectroscopy (pb-RAIRS), sputter
depth profiling X-ray photoelectron spectroscopy (XPS), spectroscopic ellipsometry (SE), atomic force
microscopy (AFM), and device electrical tests. Independent of direct attachment chemistry, we report the
remarkable observation that deposition of Au results in the displacement of the molecular film from the Si
interface. In contrast, the directly attached molecular films are robust toward the deposition of Ag. For both
metals, the C18 films formed by hydrosilation reactions on SiO2 remain at the interface. The results of
monolayer stability with metal are linked to reactions between the metal and substrate. The displacement of
the films by Au is attributed to Au insertion in the Si backbonds, in a reaction analogous to silicide formation.
The results demonstrate that one must fully take into account the reactivity of the entire system, including
substrates, molecular functional groups, and metal electrodes, when considering the robustness of molecules
in metal junctions.