Comparison of thermal enhancements to a commercial quad flatpack

Wyland, Chris

doi:10.1109/itherm.1992.187771

Cited by 6 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Empirical work confirming this ranking of these package types has also been reported. [2] [3] [4] To our knowledge, there has been no published work comparing the electrical and reliability performance of these formats.…”

Section: Introductionmentioning

confidence: 99%

Reliability and performance of non-hermetic, surface-mount quad flat packages

Guenin

Mahulikar

Leslie

et al.

1994 Proceedings. 44th Electronic Components and Technology Conference

View full text Add to dashboard Cite

A number of non-hermetic package formats are currently available for high leadcount, surface mount IC packaging applications. These include Plastic Quad Flat Packs [PQFPs], thermally enhanced PQFPswith internal heat spreaders or exposed heat slugs, and Metal QFPs (known as MQUAD" packages). Each package format with its unique design features can claim certain advantages in the areas of cost, reliability, and performance. Various modelling and empirical studies have been reported comparing these package formats in terms of baseline thermal performance. A comprehensive involving thermal, electrical, and reliability performance has not heretofore been published. This paper reports the results of empirical studies performed on 160L, 28 mm EIAJ QFP package types: PQFP, PQFP with exposed heat slug, and Metal QFP. The performance of these package types is evaluated with reference to the design of each package.

show abstract

Section: Introductionmentioning

confidence: 99%