Comparison of the surface properties of power electronic substrates

Hromadka, Karel; Reboun, Jan; Rendl, Karel; Wirth, Vaclav; Hamáček, Aleš

doi:10.1109/isse.2015.7247979

Cited by 12 publications

(4 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Setting of this profile [12] or optimizations with statistical methods [13] were also investigated. Power electronics manufacturers utilize VPS due to the efficient soldering of large components [14][15][16][17]. Research of the energy efficiency is also under active investigations [18].…”

Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

View full text Add to dashboard Cite

Vapour Phase Soldering (VPS) is a reflow soldering method used for special assemblies, where even heat distribution, uniform and high soldering quality is critical. To aim for the best joint quality, it is important to investigate the process and the state of the work zone. While VPS is a much more complex process than regular reflow methods, our paper aims to approach the monitoring of the work zone by novel and alternative paths, which can ultimately lead to a better control on the ovens, aiming for compliance with the zero defect manufacturing, and Industry 4.0 directives. For our work, two paths were defined. With the use of an infracamera, the possibility of quantitative optical observation was investigated, also the equalized temperatures of the measured board can be verified. With pressure sensing, the state of the vapour blanket can be investigated, which can lead ultimately to more reliable working cycles. The latter method shows promising results pointing to more refined process control; the former method shows limitations in the application within the field of VPS.

show abstract

Section: Fig 1 Scheme Diagram Of Vps Ovenmentioning

confidence: 99%

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Géczy¹,

Alaya²,

Hantos

et al. 2018

2018 41st International Spring Seminar on Electronics Technology (ISSE)

View full text Add to dashboard Cite

show abstract

“…Real time temperature profiling [9] or optimizations with statistical methods [10] were also investigated by Livovsky and Tsai, respectively. Power electronics manufacturers utilize VPS due to the efficient soldering of large components [11][12][13][14][15][16]. Research of the energy efficiency is also under active investigations [17].…”

Section: Introductionmentioning

confidence: 99%

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Bozsóki

Géczy

Illés

2019

International Journal of Heat and Mass Transfer

View full text Add to dashboard Cite

In this paper the complex heat transfer process of the vapour phase soldering has been investigated on the level of electronic components. VPS is gaining increased attention lately, and the process needs different approach of modelling, compared to conventional soldering processes in electronics mass manufacturing. Component level modelling was not studied deeply in the literature before, so our focus pointed to heat transfer on large size surface mounted electronic components. Applying the Fourier type heat conduction equation, a detailed 3D thermal model of a polyester capacitor on a printed circuit board was implemented based on x-ray images of an actual assembly. Our model incorporates inner geometry, material inhomogeneity, composite materials and anisotropic thermal conductivity as important thermal features. Transient heating was calculated with Finite Difference Method combining an alternating direction implicit (ADI) approach, using averaged heat transfer coefficient. Validation measurements were taken in our VPS system. The measured data show good agreement with the calculation results and points to possible application for use in advanced engineering environment.

show abstract

“…The latest researches into VPS have also revolved around the practical use of the technology. Soldering power electronics is highly focussed use of VPS (Syed Khaja et al, 2013;Chou and Cheng, 2015;Hromadka et al, 2015;Synkiewicz et al, 2015). Energy efficiency investigations (Esfandyari et al, 2015) also revealed possible improvements with the technology regarding the temperature profiles of the soldering process.…”

Section: Introductionmentioning

confidence: 99%

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Géczy

Nagy

Illés

et al. 2017

SSMT

View full text Add to dashboard Cite

Purpose The paper aims to present an investigation of heating during vapour phase soldering (VPS) on inclined printed circuit board (PCB) substrates. The PCB is a horizontal rectangular plate from the aspect of filmwise condensation with a given inclination setting. Design/methodology/approach The paper focuses on the measurement of temperature distribution on the PCBs with a novel setup immersed in the saturated vapour space. The measuring instrumentation is optimized to avoid and minimize vapour perturbing effects. Findings The inhomogeneity of the heating is presented according to the lateral dimensions of the PCB. The inclination improves temperature uniformity, improves heat transfer efficiency; however, a minor misalignment may affect the flow and result in uneven heating. Practical implications The results can be implemented for practical improvements in industrial ovens with the use of intended inclination. The improvements may consequently point to more efficient production and better joint quality. Originality/value The novel method can be used for deeper investigation of inclination during and can be complemented with numerical calculations. The results highlight the importance of precise PCB holding instrumentation in VPS ovens.

show abstract

Comparison of the surface properties of power electronic substrates

Cited by 12 publications

References 5 publications

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Alternative Inspection Methods of Vapour Phase Soldering Work Zone

Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach

Studying heat transfer on inclined printed circuit boards during vapour phase soldering

Contact Info

Product

Resources

About