2007
DOI: 10.1002/app.25501
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Comparison of the curing kinetics of a DGEBA/acid anhydride epoxy resin system using differential scanning calorimetry and a microwave‐heated calorimeter

Abstract: The cure of an epoxy resin system, based upon a diglycidyl ether of bisphenol-A (DGEBA) with HY917 (an acid anhydride hardener) and DY073 (an amine-phenol complex that acted as an accelerator), was investigated using a conventional differential scanning calorimeter and a microwave-heated power-compensated calorimeter. Dynamic cure of the epoxy resin using four different heating rates and isothermal cure using four different temperatures were carried out and the degree of cure and reaction rates were compared. … Show more

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Cited by 12 publications
(16 citation statements)
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“…The kinetic model for a dynamic curing process with a constant heating rate can be expressed in the following form 19,20 :…”
Section: Curing Kineticsmentioning
confidence: 99%
“…The kinetic model for a dynamic curing process with a constant heating rate can be expressed in the following form 19,20 :…”
Section: Curing Kineticsmentioning
confidence: 99%
“…The curing kinetics of epoxy compositions can be studied using various research methods . DSC is one of the most popular tools for studying curing kinetics of epoxy oligomers . The kinetics of curing reaction of epoxy anhydride compounds catalyzed by tertiary amines was examined in depth elsewhere using model‐fitting non‐isothermal DSC, which is simple and convenient method of calculation of the apparent activation energy values.…”
Section: Resultsmentioning
confidence: 99%
“…[22][23][24] DSC is one of the most popular tools for studying curing kinetics of epoxy oligom-ers. [25][26][27][28][29][30] The kinetics of curing reaction of epoxy anhydride compounds catalyzed by tertiary amines was examined in depth elsewhere 31 using model-fitting non-isothermal DSC, which is simple and convenient method of calculation of the apparent activation energy values. The authors plotted the heating rate versus the exothermic peak temperature, and calculated the apparent activation energy from eq 1:…”
Section: Kinetics Investigation Using Dsc Methodsmentioning
confidence: 99%
“…The present molar ratio is common to commercial epoxy adhesives (see ref. [18][19]. As for a reference adhesive, DGEBA was used instead of DGPDC.…”
Section: Resultsmentioning
confidence: 99%