Comparison of results from empirical ALT test to CAE simulation for wireless clients

Abstract

Purpose -The purpose of this paper is to investigate how to reduce the time and cost required to conduct reliability testing. With increasing competition in the electronics industry and reduction in product life cycles, it is essential to diminish the time required for new product development and thus time to market. Design/methodology/approach -This study conducts empirical sample test for wireless card and analyzes the fatigue life through finite element modeling (FEM). Simulation results are compared to the data collected from a temperature cycling test under conditions of 2408C to 1508C and 2408C to 1008C. Findings -Assuming that the results of product lifetime from empirical sample test and software simulation exhibit a linear relationship, a "scale factor" should exist for any given product structure, process condition and materials composition scenario. The scale factors were found to be approximately 0.1 in both temperature cycling scenarios. Also, the effectiveness of various adhesive dispensing patterns on solder joint reliability is evaluated through software simulation. The L shape adhesive dispensing was proven to effectively enhance the fatigue life of chip scale package solder joints roughly 100-fold. Originality/value -The scale factor is used to convert the results from software simulation to empirical sample test for a given set of processing environments and materials. This helps to reduce the time and cost required to conduct reliability testing.

Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly

“…Occurrence of voids in solder joints may compromise the solder joint reliability. Much research has discussed the influence of thermal fatigue on solder joint reliability (Amalu and Ekere, 2012; Li and Wang, 2007; Huang and Huang, 2011). QFN packages have been used with power amplifier components in electronic products such as mobile phones and personal digital assistants applications, where the large voids may cause premature failure or even immediate cracking of solder joints upon gentle impact (Liu et al , 2005; Lo et al , 2008; Huang et al , 2012).…”

DOM Products: Activation Energy Estimation and Reliability Assessment

“…As life cycles for consumer products shrink, the accelerated life test (ALT) is used to reduce the product test time and thus the time to market [1]. Based on the Arrhenius model, the acceleration factor is assessed using the testing temperature, the pre-exponential factor, the Boltzmann constant, and the activation energy.…”