2014
DOI: 10.2528/pierm14073002
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Comparison of Packaging Technologies for Rf Mems Switch

Abstract: The present paper describes an integrated approach for design, fabrication and encapsulation of RF MEMS switches in view of the optimal performance subsequent to packaging. 'Top and bottom contact' fabrication approaches are explored using different RF MEMS switch topologies. In the 'bottom contact package (BCP)' the packaging cap alignment is less critical as compared to the top contact packaging (TCP) approach where contact via is an integral part of the cap. In this case, the connection layout through silic… Show more

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Cited by 7 publications
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“…Once the preprocessing is done, the dataset is divided into training and validation dataset [17,18]. 80% of the data is kept for training the model, and 20% is kept for validating the performance of the model.…”
Section: Digitization and Preprocessing Of Datasetmentioning
confidence: 99%
“…Once the preprocessing is done, the dataset is divided into training and validation dataset [17,18]. 80% of the data is kept for training the model, and 20% is kept for validating the performance of the model.…”
Section: Digitization and Preprocessing Of Datasetmentioning
confidence: 99%