Comparison of optimised conditions for inductively coupled plasma‐reactive ion etching of quartz substrates and its optical applications

Tang, Yu-Hsiang; Lin, Yu-Hsin; Chen, Po-Li; Shiao, Ming‐Hua; Hsiao, Chien-Nan

doi:10.1049/mnl.2014.0093

Cited by 7 publications

(3 citation statements)

References 40 publications

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“…Second, inductively coupled-plasma (ICP) reactive-ionetch (RIE) was used to transfer the pattern and etch through the 220-nm silicon layer. [21] The top-view microscope image of the fabricated device is shown in Fig. 4.…”

Section: Fabrication and Testmentioning

confidence: 99%

Coupled resonator-induced transparency on a three-ring resonator

Jiao

et al. 2018

Chinese Phys. B

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The coupled resonator-induced transparency (CRIT) phenomenon, which is analogous to electromagnetically induced transparency in atomic systems, can occur in an original integrated optical resonator system due to the coherent interference of the coupled optical resonators. The system was composed of three ring resonators on silicon, each with the same cavity size, and the optical coupling to the input and output ports was achieved using grating with a power coupling efficiency of 36%. A CRIT resonance whose spectrum shows a narrow transparency peak with a low group velocity was demonstrated. The quality factor of the ring resonator can attain a value up to 6×10 4 , and the harmonic wavelength can be controlled by adjusting the temperature. The through and drop transmission spectra of the resonator are reconciled well with each other and also consistent well with the theoretical analysis.

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Section: Fabrication and Testmentioning

confidence: 99%

Coupled resonator-induced transparency on a three-ring resonator

Jiao

et al. 2018

Chinese Phys. B

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“…Moreover, the machining accuracy is too low to manufacture much smaller micro-resonators. Therefore, a deep dry etching method with inductively coupled plasma has been investigated to obtain an excepted profile [ 4 , 5 , 9 , 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 ].…”

Section: Introductionmentioning

confidence: 99%

“…Several typical masks, such as metal masks, photoresist masks and metallic compound masks have been discussed so far [ 24 , 28 , 34 , 35 , 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 ]. It is known that the deep and high etching rate of glasses is not feasible with standard photoresist masks due to low selectivity and mask profile degradation during the prolonged process [ 37 , 38 ].…”

Section: Introductionmentioning

confidence: 99%

Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication

Zhao

et al. 2020

Micromachines

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Quartz is widely used in microelectromechanical systems (MEMS). Especially, MEMS quartz resonators are applied to sensors and serve as sensitive elements. The capability of deep etching is a limitation for the application. Presented in this paper is a deep and high accuracy reactive ion etching method applied to a quartz resonator etching process with a Cr mask. In order to enhance the capability of deep etching and machining accuracy, three kinds of etching gas (C4F8/Ar, SF6/Ar and SF6/C4F8/Ar), bias power, inductively coupled plasma (ICP) power and chamber pressure were studied in an industrial reactive ion etching machine (GDE C200). Results indicated that the SF6/C4F8/Ar chemistry gas is the suitable and optimal choice. Experiment results indicate that Cr (chromium) mask can obtain a higher selectivity than aluminum and titanium mask. A “sandwich” structure composed of Al layer-Cr layer-Al layer-Cr layer was proposed. The Al (aluminum) film can play the role of releasing stress and protecting gold electrodes, which can enhance the thickness of metal mask. An optimized process using SF6/C4F8/Ar plasmas showed the quartz etching rate of 450 nm/min. Meanwhile, a microchannel with a depth of 75.4 µm is fabricated, and a nearly vertical sidewall profile, smooth surface is achieved.

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Dynamic process of wet etching using BOE solutions to control the etch rate, roughness, and surface morphology of a Z-cut α-quartz wafer

Xue,

Zhang,

et al. 2024

Ceramics International

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Comparison of optimised conditions for inductively coupled plasma‐reactive ion etching of quartz substrates and its optical applications

Cited by 7 publications

References 40 publications

Coupled resonator-induced transparency on a three-ring resonator

Coupled resonator-induced transparency on a three-ring resonator

Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication

Dynamic process of wet etching using BOE solutions to control the etch rate, roughness, and surface morphology of a Z-cut α-quartz wafer

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