Comparison of one-pot and two-step polymerization of polyimide from BPDA/ODA

Abstract

SYNOPSISThe one-pot method polymerization of polyimide was carried out from 3,3',4,4'-biphenyl tetracarboxylic dianhydride (BPDA) and 4,4'-oxydianiline (ODA) by the use of p-chlorophenol as the solvent. The behavior of the polymerization was compared with that of the two-step method. The imidization reaction in the one-pot method proceeds completely in this system at even a low temperature such as 100°C. In the course of the film preparation from the solution, the embrittlement occurs when the film is prepared from polyamic acid solution, while it does not occur in the case of that from the solution of the one-pot method. A molecular weight of polyimide film is almost the same as that of precursor polyimide in the solution. In the same way, that of polyimide film is almost the same as that of precursor polyamic acid. The mechanical properties of the polyimide film prepared by the one-pot method are similar to those by the two-step method. 0 1996 John Wiley & Sons, Inc.

Synthesis and Characterization of a Highly Soluble Aromatic Polyimide from 4,4′-Methylenebis(2-tert-butylaniline)

“…[15] The two-step method is very useful when dealing with highly reactive monomers. In the first step, a poly(amic acid) is formed at low temperature, and then the intermediate is converted into the polyimide by means of thermal or chemical imidization.…”

Preparation of polyimide films via microwave-assisted thermal imidization

“…1-3 A typical two-step method is mainly adopted in preparing PI lms, involving the synthesis of polyamide acid (PAA) precursors primarily and the imidization process through thermal or chemical treatment. 4,5 The intermediate PAA is converted to PI by the imidization route and this process plays a decisive role on the nal properties of PI products. However, during the thermal imidization process, both imidization and crystallization happen simultaneously at 150-350 C, resulting in the brittleness of materials, 6,7 and side effects including oxidation and degradation tend to occur at high temperatures.…”

Photoimageable polyimides derived from α,α‐(4‐amino‐3,5‐dimethylphenyl)phenylmethane and aromatic dianhydride

“…Photosensitive polyimides (PSPIs), because of their excellent combined physical and chemical features and easy processing characteristics, have been extensively employed in advanced microelectronics packaging as interlayer dielectrics in multilayer structures and dielectric multichip modules, passivation layers and α‐particle barriers on chips, stress relief buffer coatings in high‐density electronic packaging, and so forth 1–9. PSPIs, in the negative photoimaged mode, are usually formulated from poly(amic acid)s (PAAs), which contain photosensitive crosslinking sites in polymer backbones introduced either by chemical bonding or by saltlike linking 10–12.…”

“…Photosensitive polyimides (PSPIs), because of their excellent combined physical and chemical features and easy processing characteristics, have been extensively employed in advanced microelectronics packaging as interlayer dielectrics in multilayer structures and dielectric multichip modules, passivation layers and ␣-particle barriers on chips, stress relief buffer coatings in highdensity electronic packaging, and so forth. [1][2][3][4][5][6][7][8][9] PSPIs, in the negative photoimaged mode, are usually formulated from poly(amic acid)s (PAAs), which contain photosensitive crosslinking sites in polymer backbones introduced either by chemical bonding or by saltlike linking. 10 -12 Their major drawbacks for advanced microelectronics applications include the heavy dimensional shrinkage and deteriorated mechanical properties of the thermally cured polyimide photopatterns caused by the significant evolution of organic volatiles derived from the photosensitive additives and solvents.…”