Comparison of mechanical resistance of SnCu and SnBi of solder joints

Dusek, Karel; Busek, David; Petrac, Adam; Placek, Martin; Kozak, Martin; Molhanec, Martin; Pelikanova, Ivana Beshajova

doi:10.1109/isse.2017.8000924

Cited by 2 publications

(1 citation statement)

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“…A distinction between OSP and HASL in the field of soldering and PCBs was determined by several studies. Dušek et al [ 31 ] detected stronger mechanical resistance of soldered joints for HASL. In the work of Vasko et al [ 32 ], HASL provided better wettability than OSP.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application

2021

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The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on the thermomechanical properties of the composites was evaluated. Three different laminates with various thermal endurances were included in the study. Soldering pads were covered with OSP and HASL surface finishes. The strength of the cohesion of the resin upper layer was examined utilizing a newly established method designed for pulling tests. Experiments studying the bond strength were performed at a selection of laminate temperatures. Changes in thermomechanical behavior were observed by thermomechanical and dynamic mechanical analyses. The results confirmed the influence of the type of laminate and used surface finish on bond strength. In particular, permanent polymer degradation caused by thermal shock during HASL application was observed in the least thermally resistant laminate. A response to thermal shock was detected in thermomechanical properties of other laminates as well, but it does not seem to be permanent.

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Section: Introductionmentioning

confidence: 99%