Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers

Niittynen, Juha; Sowade, Enrico; Kang, Hong Tae; Baumann, Reinhard R.; Mäntysalo, Matti

doi:10.1038/srep08832

Cited by 149 publications

(105 citation statements)

References 14 publications

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“…However, at the time, no suitable inkjettable Ni ink was available for this experiment. Copper ink could be another alternative option; however, in our experience, Cu annealing processes are relatively complex, typically requiring photonic or thermal annealing in inert atmosphere with forming gas 22,23 .…”

Section: Materials Selection For Tsv Fillingmentioning

confidence: 99%

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

et al. 2017

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Interposers with through-silicon vias (TSVs) play a key role in the three-dimensional integration and packaging of integrated circuits and microelectromechanical systems. In the current practice of fabricating interposers, solder balls are placed next to the vias; however, this approach requires a large foot print for the input/output (I/O) connections. Therefore, in this study, we investigate the possibility of placing the solder balls directly on top of the vias, thereby enabling a smaller pitch between the solder balls and an increased density of the I/O connections. To reach this goal, inkjet printing (that is, piezo and super inkjet) was used to successfully fill and planarize hollow metal TSVs with a dielectric polymer. The under bump metallization (UBM) pads were also successfully printed with inkjet technology on top of the polymer-filled vias, using either Ag or Au inks. The reliability of the TSV interposers was investigated by a temperature cycling stress test (−40°C to +125°C). The stress test showed no impact on DC resistance of the TSVs; however, shrinkage and delamination of the polymer was observed, along with some micro-cracks in the UBM pads. For proof of concept, SnAgCu-based solder balls were jetted on the UBM pads.

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Section: Materials Selection For Tsv Fillingmentioning

confidence: 99%

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

et al. 2017

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“…In this study, copper nanoparticle ink is used due to its high electrical conductivity and low cost compared to silver and gold [11][12][13][14]. However, since copper has a high rate of oxidation, the sintering process must be performed in an inert atmosphere [15]. Unlike silver oxides, copper oxides are non-conductive material [15].…”

Section: Fss Design and Realisation Techniquesmentioning

confidence: 99%

“…However, since copper has a high rate of oxidation, the sintering process must be performed in an inert atmosphere [15]. Unlike silver oxides, copper oxides are non-conductive material [15]. …”

Section: Fss Design and Realisation Techniquesmentioning

confidence: 99%

Characterisation of Copper Nanoparticle Ink Printed FSS for Cellular Signals Suppression

Seman¹,

Khalid²,

Said³

2016

PIER Letters

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Abstract-This paper proposes a copper nanoparticle ink printed frequency selective surface (FSS) for cellular signals suppression. The FSS pattern is deposited on a polyimide film by using an inkjet printing technique. The printed FSS elements undergo the post-processing called sintering, where the optimum exposure duration and temperature are determined in order to form a conductive path across the metal pattern. Later, the conductivity of the printed FSS structure deposited on polyimide film is observed. The signal suppression ability of the printed FSS is conducted using the Computer Simulation Technology (CST) Microwave Studio software.

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“…[13][14][15][16][17][18][19][20] The specific nature of each sintering treatment (e.g., photo nic sintering vs chemical methods) influences the time as well as the feasibility. Many sintering treatments are reported for metal particle inks (e.g., processes with laser, flashed light, microwave, thermal, plasma, electrical, and chemical sintering).…”

mentioning

confidence: 99%

Truly Low Temperature Sintering of Printed Copper Ink Using Formic Acid

Hermerschmidt

Burmeister

Ligorio

et al. 2018

Adv Materials Technologies

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write technique that requires no masks or lithographic prepatterning of substrates and is compatible with printing manufacturing. Its drop-on-demand (DoD) technology allows the ink droplets to be deposited exactly where required on the substrate, [6] therefore minimizing material loss. Moreover, inkjet printing can be upscaled and transferred to a roll-toroll (R2R) process, [7,8] which can yield a productivity of up to 6 m 2 min −1 , while also producing small feature sizes down to 10 µm and varying shapes. [9][10][11][12] This paves the way to fully solution-processed devices, with all layers including the electrodes being deposited from an ink.The most often used ink formulations can roughly be divided into two categories: inks made from capped metal nanoparticles and metal-organic decomposition inks. [13] To prevent nozzle clogging and comply with printhead restrictions, the inks often contain low metal loading and stabilizers. A treatmentThe fabrication and feasibility of inkjet-printed electrodes for devices such as organic field-effect transistors (OFETs), highly efficient organic photovoltaics (OPVs), and high performance organic light-emitting diodes (OLEDs) underline the versatility of this printing method. [1][2][3][4][5] Inkjet printing is an additive, direct

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Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers

Cited by 149 publications

References 14 publications

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Inkjet printing technology for increasing the I/O density of 3D TSV interposers

Characterisation of Copper Nanoparticle Ink Printed FSS for Cellular Signals Suppression

Truly Low Temperature Sintering of Printed Copper Ink Using Formic Acid

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