2011
DOI: 10.1016/j.microrel.2011.07.031
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Comparison of IGBT short-circuit failure “ohmic mode”: Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters

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Cited by 8 publications
(3 citation statements)
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“…In this paper, both isolation and reconfiguration steps are combined through the proposition of a new hardware procedure. It is a simplification of the isolation and reconfiguration technique proposed in [25, 26], and applied for a two‐level converter. Fig.…”
Section: Improved Fault Isolation and Converter Reconfiguration Tecmentioning
confidence: 99%
See 1 more Smart Citation
“…In this paper, both isolation and reconfiguration steps are combined through the proposition of a new hardware procedure. It is a simplification of the isolation and reconfiguration technique proposed in [25, 26], and applied for a two‐level converter. Fig.…”
Section: Improved Fault Isolation and Converter Reconfiguration Tecmentioning
confidence: 99%
“…5 b . The 3L‐FC leg control uses the FC topology degrees of freedom reported in [26] and is three‐level modulated (0, E /2, − E /2). For, the two remaining 3L‐NPC legs, and since the NP voltage is no more available, they have to be two‐level modulated and isolated from their mid‐point: their two upper (respectively lower) switches have to be similarly controlled.…”
Section: Normal Condition and Post‐fault Operationsmentioning
confidence: 99%
“…Fuses are simple, passive and inexpensive components, able to isolate faulty circuits paths in case of excessive current flow due to a failure. They allow in some fault-tolerant power converters topologies [1]- [3] to avoid spreading failure by separating failed circuit parts, thus enabling the continuous operation of the system. In Fig.…”
Section: Introductionmentioning
confidence: 99%