2010
DOI: 10.1002/cvde.200906800
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Comparison of Coupling Methods for Linking Between Reactor and Feature Scales

Abstract: Currently there are two main methods used for coupling macroscopic reactor-scale and microscopic feature-scale models in multi-scale CVD simulation. These methods differ in the plane selected for coupling. With one method, coupling occurs at a source plane offset from the deposition surface, while in the other method coupling occurs on the deposition surface itself. The two methods also have different feature-scale modeling techniques associated with them. A Monte Carlo (MC) technique is used for the source pl… Show more

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Cited by 4 publications
(1 citation statement)
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“…This approach is investigated in this work with a multi‐scale modeling framework coupling reactor with feature scale models. Even if there are previous works on coupling a reactor with feature scale models in CVD processes, with two of them including calculations for non‐uniform densities of features on the wafer, the contribution of this work is a design methodology for feature, pattern, device, or die density on the wafer which improves the macroscopic uniformity in CVD processes. Even if it is difficult to practically implement a variation of feature density on the wafer, this work deals with features as they consist the simplest unit cell of topography; the same methodology can be applied to patterns constituting devices or dies on the wafer.…”
Section: Introductionmentioning
confidence: 99%
“…This approach is investigated in this work with a multi‐scale modeling framework coupling reactor with feature scale models. Even if there are previous works on coupling a reactor with feature scale models in CVD processes, with two of them including calculations for non‐uniform densities of features on the wafer, the contribution of this work is a design methodology for feature, pattern, device, or die density on the wafer which improves the macroscopic uniformity in CVD processes. Even if it is difficult to practically implement a variation of feature density on the wafer, this work deals with features as they consist the simplest unit cell of topography; the same methodology can be applied to patterns constituting devices or dies on the wafer.…”
Section: Introductionmentioning
confidence: 99%