2006
DOI: 10.1007/s00170-006-0709-x
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Comparison of bonding procedures for 3D-structured polyimide films on silicon substrates applied to ink-jet cartridges

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Cited by 2 publications
(2 citation statements)
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“…Known thick film laminate technologies, based on heat and pressure sensitive films allow for the simple stacking of individual electrode array layers and should result in a straightforward 3D array structure. [37][38][39][40] The large size of Xenopus Oocytes allowed the use of simple electrode fabrication techniques, but technology is already available to fabricate micron-sized metal electrodes that surround 10 mm diameter cells. 18,26,32 Furthermore, electron-beam and ion-beam lithography have been used to construct nanometer-sized electrodes that can analyze DNA sequences and detect glucose containing analytes.…”
Section: Discussionmentioning
confidence: 99%
“…Known thick film laminate technologies, based on heat and pressure sensitive films allow for the simple stacking of individual electrode array layers and should result in a straightforward 3D array structure. [37][38][39][40] The large size of Xenopus Oocytes allowed the use of simple electrode fabrication techniques, but technology is already available to fabricate micron-sized metal electrodes that surround 10 mm diameter cells. 18,26,32 Furthermore, electron-beam and ion-beam lithography have been used to construct nanometer-sized electrodes that can analyze DNA sequences and detect glucose containing analytes.…”
Section: Discussionmentioning
confidence: 99%
“…We assume that the part of the fiber that the stage has to support has a length of 1 cm, where we would install an additional stage for relieving a mechanical strain to the main fiber stage or applying an additinoal feedback voltage to stabilize the cavity frequency. The mass of glue is neglected [79].…”
Section: Mass Of the Fiber Stagementioning
confidence: 99%