2016 IEEE Conference on Electromagnetic Field Computation (CEFC) 2016
DOI: 10.1109/cefc.2016.7816193
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Comparing partial element equivalent circuit and finite element methods for the resonant wireless power transfer 3D modeling

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Cited by 4 publications
(5 citation statements)
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“…Improving magnetic field quality estimated at receiving coil in the WPT framework was explored utilising a metallic core produced using cast iron inside receiving coil [31, 32].…”
Section: Computational Domainmentioning
confidence: 99%
“…Improving magnetic field quality estimated at receiving coil in the WPT framework was explored utilising a metallic core produced using cast iron inside receiving coil [31, 32].…”
Section: Computational Domainmentioning
confidence: 99%
“…The primary voltage-source is constructed as full-wave one-phase converter (schematically shown in Figure 6). Its power loss PCONV is determined by using a suitable loss estimation algorithm Equation (19) widely reported in literature [38][39] The resonant tank is then described with modified set of two equations of two unknowns that are presented in Equation (17). The power on both sides may be calculated based on Equation 5.…”
Section: Of 19mentioning
confidence: 99%
“…The primary voltage-source is constructed as full-wave one-phase converter (schematically shown in Figure 6). Its power loss P CONV is determined by using a suitable loss estimation algorithm Equation (19) widely reported in literature [38,39]. Here, E on and E o f f represent the switching energy of the used power electronics devices.…”
Section: Of 19mentioning
confidence: 99%
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“…Since then, there has been a growing interest in the PEEC method which has been applied to a large variety of different fields including power electronics [15], [16], [17], [18], [19], [20], power systems [21], [22], antennas [23], [24], [25], [26], [27], [28], [29], [30], radio-frequency integrated circuits (RFICs) [31], [32] and RF interferences [33], lightning [34], [35], [36], filters [37], [38], on-chip interconnects [39], frequency selective surfaces [40], [41], [42], Litz wires [43], [44], [45], [46], neuromorphic chip crossbar array [47], flexible electronics [48], [49], high-temperature superconducting (HTS) cables [50], decoupling capacitors [51], wireless power transfer [52], [53], [54], and return network in composoite aircraft [55], just to name a few. The list of applications and contributors increases continuously due to recent improvements.…”
mentioning
confidence: 99%